Abstract: A system includes processing circuitry and a drone that includes a marking mount that receives a marking device, a motion guide that provides a sliding framework for a reciprocating motion of the marking mount, and a shock absorption sub-assembly positioned between the marking mount and the motion guide. Control logic of the drone is configured to navigate, based on navigation instructions received from the processing circuitry, the drone to an area associated with a misapplication of a tape as applied to a substrate or a substrate defect, such that a distal tip of the marking device makes contact with the area associated with the tape misapplication or the substrate defect, while activating the shock absorption sub-assembly to at least partially absorb a shock caused by the contact between the distal tip of the marking device and the area associated with the tape misapplication or the substrate defect.

Abstract: A head-mountable device can include a display, an arm, a bi-stable hinge connecting the arm to the display, the bi-stable hinge and the arm including an open position, a folded position, and a splay position. A first electronic component can be positionally fixed between the display and the bi-stable hinge, a second electronic component can be positioned distal to the bi-stable hinge, and a cable can connect the first electronic component and the second electronic component, the cable being routed through the bi-stable hinge.

Abstract: A rib post (10) has a hollow substantially triangular cross-section comprising composite material. The rib post (10) can form a structural member to join two adjacently placed components together, for example a spar and internal rib in a wing of an aircraft. The rib post (10) can be formed from first (12), second (14) and third (16) walls. The first wall (12) can abut a surface of one component and the second wall (14) can abut a surface of a second component. The first and second walls (12, 14) can be attached to the respective components, such as a rib and spar, to join them together. The third wall (16) joins together the first and second walls (12, 14) to form the hollow triangular section.

Abstract: A rib post (10) has a hollow substantially triangular cross-section comprising composite material. The rib post (10) can form a structural member to join two adjacently placed components together, for example a spar and internal rib in a wing of an aircraft. The rib post (10) can be formed from first (12), second (14) and third (16) walls. The first wall (12) can abut a surface of one component and the second wall (14) can abut a surface of a second component. The first and second walls (12, 14) can be attached to the respective components, such as a rib and spar, to join them together. The third wall (16) joins together the first and second walls (12, 14) to form the hollow triangular section.

Abstract: A skin grooming device comprising a planar surface for removable attachment to a stationary surface, having affixed thereto an undulating abrasive block for use in abrading rough, dead, or dry skin from keratinous surfaces and a method for grooming skin using the device.

Abstract: A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

Abstract: A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

Abstract: A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

Abstract: A fiber data distributed interface (FDDI) system uses an MLT3A encoding scheme in order to reduce DC bias or baseline wander. The MLT3A encoding scheme is a scheme wherein logical zeros are transmitted as ground voltages and logical ones are transmitted as one of either positive voltages or negative voltages depending upon past transmission history (FIG. 4 ) wherein the past history is recorded by a counter C or an analog circuit. MLT3A ensures that the baseline wander or DC bias returns to zero or is maintained as close to zero as possible in a timely manner so that no FDDI systems will fail from baseline wander.

Abstract: An integrated circuit for use in fiber distributed data interface (FDDI) system has four elastic layer and buffer management (ELM) circuits (12, 14, 16, and 18) coupled through a crossbar switch (20). The crossbar switch (20) allows any of the ELM circuits (12, 14, 16, and 18) to be coupled to any other ELM circuit (12, 14, 16, or 18) or to one of three external buses for FDDI communication. By using a crossbar switch and four ELM devices on a single integrated circuit, FDDI performance is improved while system design is made easier and more flexible than previously possible. Cipher circuitry (22, 24, 26, and 28) is used to scramble and descramble data ingoing and outcoming from the ELM devices. Concentrators, workstations, local area networks (LANs), and the like may incorporate the circuit (10) to improve performance and flexibility.

Abstract: A bicycle frame supports a sprocket, front and rear wheels and first gears axially aligned with the rear wheel. Each gear has an individual ratio with the sprocket. At a first end, a support is attached to the frame at two (2) spaced positions, one axially aligned with the rear wheel. When loosened from the frame at such aligned position, the support is pivotable at the other position to provide access to the rear wheel and the gears for maintenance or repair. At its second end, the support holds a hollow shaft in a direction substantially parallel to the gear peripheries. A drive motor, a screw and a yoke mounted on the screw extend in this parallel direction within the shaft. Channels in the shaft receive the yoke to constrain yoke rotation. The motor drives the screw and yoke to position a spool linearly in the parallel direction. A takeup arm movable with the spool carries an additional gear into alignment with an individual one of the gears.

Abstract: A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

Abstract: An integrated circuit for use in fiber data distributed interface (FDDI) system has four elastic layer and buffer management (ELM) circuits (12, 14, 16, and 18) coupled through a crossbar switch (20). The crossbar switch (20) allows any of the ELM circuits (12, 14, 16, and 18) to be coupled to any other ELM circuit (12, 14, 16, or 18) or to one of three external buses for FDDI communication. By using a crossbar switch and four ELM devices on a single integrated circuit, FDDI performance is improved while system design is made easier and more flexible than previously possible. Cipher circuitry (22, 24, 26, and 28) is used to scramble and descramble data ingoing and outcoming from the ELM devices. Concentrators, workstations, local area networks (LANs), and the like may incorporate the circuit (10) to improve performance and flexibility.