Patents by Inventor Paul M. Bischoff

Paul M. Bischoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Scanning methods for focus control for lithographic processing of reconstituted wafers
    Patent number: 10269662
    Abstract: A method of processing a reconstituted wafer that supports IC chips includes operably disposing the reconstituted wafer in a lithography tool that has a depth of focus and a focus plane and that defines exposure fields on the reconstituted wafer, wherein each exposure field includes at least one of the IC chips. The method also includes scanning the reconstituted wafer with a line scanner to measure a surface topography of the reconstituted wafer as defined by the IC chips. The method also includes, for each exposure field: i) adjusting a position and/or an orientation of the reconstituted wafer so that a photoresist layers of the IC chips within the given exposure field fall within the depth of focus; and ii) performing an exposure with the lithography tool to pattern the photoresist layers of the IC chips in the given exposure field.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: April 23, 2019
    Assignee: Ultratech, Inc.
    Inventors: Paul M. Bischoff, Emily M. True, Raymond Ellis, A. J. Crespin
  • Scanning Methods For Focus Control For Lithographic Processing Of Reconstituted Wafers
    Publication number: 20180166348
    Abstract: A method of processing a reconstituted wafer that supports IC chips includes operably disposing the reconstituted wafer in a lithography tool that has a depth of focus and a focus plane and that defines exposure fields on the reconstituted wafer, wherein each exposure field includes at least one of the IC chips. The method also includes scanning the reconstituted wafer with a line scanner to measure a surface topography of the reconstituted wafer as defined by the IC chips. The method also includes, for each exposure field: i) adjusting a position and/or an orientation of the reconstituted wafer so that a photoresist layers of the IC chips within the given exposure field fall within the depth of focus; and ii) performing an exposure with the lithography tool to pattern the photoresist layers of the IC chips in the given exposure field.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 14, 2018
    Inventors: Paul M. Bischoff, Emily M. True, Raymond Ellis, A.J. Crespin