Abstract: Laminated microfluidic structures and methods for manufacturing the same are provided. In some instances, a laminated microfluidic structure is provided which includes a distended region having a sipper port at the bottom and an internal channel that fluidically connects the sipper port to a location outside of the distended region. Thermoforming and/or injection molding techniques for manufacturing such laminated microfluidic structures are provided. In other instances, a laminated microfluidic structure may be co-molded with a polymeric material to produce an integrated laminated microfluidic structure and housing.

Abstract: The present invention is embodied in a system and method for optimizing the temperature operating range for a thermal inkjet printhead using pigmented ink over large print swaths. The printhead assembly includes connection and processing circuitry, a printhead body, ink channels, a substrate, such as a semiconductor wafer (commonly referred to as a die), a nozzle member and a barrier layer located between the wafer and nozzle member. The nozzle member has heating elements in arrays, as well as plural nozzles coupled to respective ink channels and is secured at a predefined location to the printhead body with a suitable adhesive layer. The printhead also includes a controller, which can be an integrated circuit processor, a printer driver, firmware or the like for controlling an increase in the mean temperature of the die through a feedback loop.

Abstract: The present invention is embodied in a system and method for optimizing the temperature operating range for a thermal inkjet printhead using pigmented ink over large print swaths. The printhead assembly includes connection and processing circuitry, a printhead body, ink channels, a substrate, such as a semiconductor wafer (commonly referred to as a die), a nozzle member and a barrier layer located between the wafer and nozzle member. The nozzle member has heating elements in arrays, as well as plural nozzles coupled to respective ink channels and is secured at a predefined location to the printhead body with a suitable adhesive layer. The printhead also includes a controller, which can be an integrated circuit processor, a printer driver, firmware or the like for controlling an increase in the mean temperature of the die through a feedback loop.