Patents by Inventor Paul M. Schreier

Paul M. Schreier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9544673
    Abstract: A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone ASIC are implemented as stacked die on the package substrate. In yet another aspect, the speaker driver and the microphone ASIC are implemented as a single die on the package substrate.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: January 10, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Jerad M. Lewis, Paul M. Schreier, Kieran P. Harney, Joshua C. LeMaire, Aleksey S. Khenkin
  • Publication number: 20160182987
    Abstract: A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone ASIC are implemented as stacked die on the package substrate. In yet another aspect, the speaker driver and the microphone ASIC are implemented as a single die on the package substrate.
    Type: Application
    Filed: December 22, 2014
    Publication date: June 23, 2016
    Inventors: Jerad M. Lewis, Paul M. Schreier, Kieran P. Harney, Joshua C. LeMaire, Aleksey S. Khenkin