Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, optionally a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to about 9.0, such as less than or equal to about 7.5.

Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, optionally a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to about 9.0, such as less than or equal to about 7.5.

Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to 9.0, such as less than or equal to about 7.5.

Abstract: The present invention discloses an automatic self-adjusting thermally powered expansion valve for controlling the flow of refrigerant to an evaporator of a refrigeration system. The valve includes a differential fluid amplifier transducer which produces a constant flow of refrigerant independent of the liquid line pressure and includes a generally cylindrical interior with an inlet chamber having an inlet port and an outlet chamber having an outlet port and an orifice between the chambers providing a passage for the flow of refrigerant through the valve. The flow of refrigerant through the valve is regulated by a valve element, which moves longitudinally within the chambers with respect to the orifice. The longitudinal position of the valve element is controlled by force generators and sensors. The position of the valve element depends on the fluid pressure and the size of the pressure disks, and the spring constant of the compression spring.

Abstract: A cargo deck bearing assembly (8) comprising a housing (10) formed of a lightweight material, and means (14) integral therewith for attaching the housing (10) to an airplane cargo deck. A plurality of cavities (18) are provided in the housing (10) at its upper surface (20), generally arranged in the form of a circle. A generally hemispherical cup (22) is disposed in each of the cavities (18). A plurality of small bearing balls (24) are disposed in a single layer over the inner surface of the cup (22), and a single larger bearing ball (28) is disposed over the layer of small bearing balls (24). A rigid skid plate (30) is affixed to the upper surface (20) of the housing over the bearing balls. The skid plate (30) is provided with a plurality of circular apertures (34), one aperture superposed over each of the larger bearing balls (28). The structure results in a lightweight cargo bearing assembly (8) providing low resistance to movement of cargo bins thereover in any direction.