Abstract: An optical device (1), comprising: —a first optical transparent thermoplastic layer (2); —a second optical transparent thermoplastic layer (3), and; in between both thermoplastic layers (2, 3); • a diffractive optical element (4) adjacent to the first thermoplastic layer (2), • a spacer (5) in between the diffractive optical element (4) and the second thermoplastic layer (3), and; • a border (6) enclosing the diffractive optical element (4) thereby forming a sealed cavity (7); wherein at least an upper part of the border (6), adjacent to the cavity (7) is formed from an adhesive (15).

Abstract: The present disclosure describes optical devices and methods for manufacturing such optical devices. Namely, an example optical device includes a first optical transparent thermoplastic layer, a second optical transparent thermoplastic layer, and in between both thermoplastic layers, a diffractive optical element adjacent to one thermoplastic layer, a spacer in between the diffractive optical element and the other thermoplastic layer and, a border enclosing the diffractive element thereby forming a sealed cavity.

Abstract: An optical device (1), comprising: —a first optical transparent thermoplastic layer (2); —a second optical transparent thermoplastic layer (3), and; in between both thermoplastic layers (2, 3); • a diffractive optical element (4) adjacent to the first thermoplastic layer (2), • a spacer (5) in between the diffractive optical element (4) and the second thermoplastic layer (3), and; • a border (6) enclosing the diffractive optical element (4) thereby forming a sealed cavity (7); wherein at least an upper part of the border (6), adjacent to the cavity (7) is formed from an adhesive (15).

Abstract: The present disclosure describes optical devices and methods for manufacturing such optical devices. Namely, an example optical device includes a first optical transparent thermoplastic layer, a second optical transparent thermoplastic layer, and in between both thermoplastic layers, a diffractive optical element adjacent to one thermoplastic layer, a spacer in between the diffractive optical element and the other thermoplastic layer and, a border enclosing the diffractive element thereby forming a sealed cavity.

Abstract: A test circuit and method for testing through-silicon-vias (TSVs) in three-dimensional integrated circuits (ICs) during each phase of manufacturing is disclosed. In one aspect, the method includes testing for faults in each individual TSV, TSV-under-test, shorts between a TSV-under-test, and TSVs in close proximity and for connections between the TSV-under-test and another tier in the ICs. A test circuit has three switchable current paths connected to a power supply via a pull-up resistor and switches: a calibration path, a short path, and a current measurement path. A power supply is connected to the measurement path, and the calibration path and the short path are connected to ground via respective pull-down resistors. For each TSV-under-test, the desired operation mode is selected by the closure of different combinations of switches. The current flowing through the pull-up resistor in each operation mode indicates whether the TSV-under-test has passed or failed the test.

Abstract: A method and device for testing through-substrate vias (TSVs) in a 3D chip stack are disclosed. In one aspect, the 3D chip stack includes at least a first die having a first electrical circuit and a second die having a second electrical circuit. The first die further includes at least one first TSV for providing electrical connection between the first electrical circuit and the second electrical circuit. The first die further includes test circuitry and at least one second TSV electrically connected between the first TSV and the test circuitry. The electrical connection between the first TSV and the second TSV is made outside the second die. In one aspect, this allows testing the first TSV in the first die even if the second die is not provided with dedicated test circuitry.

Abstract: A test circuit and method for testing through-silicon-vias (TSVs) in three-dimensional integrated circuits (ICs) during each phase of manufacturing is disclosed. In one aspect, the method includes testing for faults in each individual TSV, TSV-under-test, shorts between a TSV-under-test, and TSVs in close proximity and for connections between the TSV-under-test and another tier in the ICs. A test circuit has three switchable current paths connected to a power supply via a pull-up resistor and switches: a calibration path, a short path, and a current measurement path. A power supply is connected to the measurement path, and the calibration path and the short path are connected to ground via respective pull-down resistors. For each TSV-under-test, the desired operation mode is selected by the closure of different combinations of switches. The current flowing through the pull-up resistor in each operation mode indicates whether the TSV-under-test has passed or failed the test.

Abstract: A method for optimizing a design for a device is disclosed. Such an optimization is performed with respect to a predetermined metric, e.g. device speed, area, power consumption or yield. In one aspect, the method comprises obtaining a design for a device. The design comprises design components. The method also comprises determining from the design components at least one group of first design components that has a higher sensitivity to the predetermined metric than second design components. The first design components may be on the critical path in the design. The method further comprises tuning the first design components and the technology for manufacturing the first design components thus reducing the variability of the first design components and obtaining an optimized design with respect to the predetermined metric.

Abstract: A measurement system for determining the capacitance of a device-under-test in an integrated circuit is disclosed. In one aspect, the measurement system has a reference circuit and a test circuit. Each circuit has first and second diodes that are switched in accordance with a clock cycle to charge and discharge the associated circuit. A method takes average current measurements for each circuit at one voltage level and processes them so that the capacitance of a device-under-test connected to the test circuit can accurately and reliably be determined. Two voltage levels may be used and adjustments are made for voltage threshold of the diodes and also their resistance.

Abstract: A method and device for testing through-substrate vias (TSVs) in a 3D chip stack are disclosed. In one aspect, the 3D chip stack includes at least a first die having a first electrical circuit and a second die having a second electrical circuit. The first die further includes at least one first TSV for providing electrical connection between the first electrical circuit and the second electrical circuit. The first die further includes test circuitry and at least one second TSV electrically connected between the first TSV and the test circuitry. The electrical connection between the first TSV and the second TSV is made outside the second die. In one aspect, this allows testing the first TSV in the first die even if the second die is not provided with dedicated test circuitry.

Abstract: A system and method of designing digital system. One aspect of the invention includes a method for designing an essentially digital system, wherein Pareto-based task concurrency optimization is performed. The method uses a system-level description of the functionality and timing of the digital system. The system-level description comprises a plurality of tasks. Task concurrency optimization is performed on said system-level description, thereby obtaining a task concurrency optimized system-level description, including Pareto-like task optimization information. The essentially digital system is designed based on said task concurrency optimized system-level description. In one embodiment of the invention, the description is includes a “grey-box” description of the essentially digital system.

Abstract: Methods, apparatus and software products are described for design-time data-assignment techniques for hierarchical memories, e.g., multi-banked memories in an essentially digital system as well as methods, apparatus and software products for run-time memory management techniques of such a system. Memory assignment techniques are described for assigning data to a hierarchical memory particularly for multi-tasked applications where data of dynamically created/deleted tasks is allocated at run-time. The energy consumption of hierarchical memories such as multi-banked memories depends largely on how data is assigned to the memory banks. Methods, apparatus and software products are described for design-time data-assignment techniques for hierarchical memories, e.g., multi-banked memories in an essentially digital system which improve a cost function such as energy consumption.

Abstract: A method for optimizing a design for a device is disclosed. Such an optimization is performed with respect to a predetermined metric, e.g. device speed, area, power consumption or yield. In one aspect, the method comprises obtaining a design for a device. The design comprises design components. The method also comprises determining from the design components at least one group of first design components that has a higher sensitivity to the predetermined metric than second design components. The first design components may be on the critical path in the design. The method further comprises tuning the first design components and the technology for manufacturing the first design components thus reducing the variability of the first design components and obtaining an optimized design with respect to the predetermined metric.

Abstract: A system and method of designing digital system. One aspect of the invention includes a method for designing an essentially digital system, wherein Pareto-based task concurrency optimization is performed. The method uses a system-level description of the functionality and timing of the digital system. The system-level description comprises a plurality of tasks. Task concurrency optimization is performed on said system-level description, thereby obtaining a task concurrency optimized system-level description, including Pareto-like task optimization information. The essentially digital system is designed based on said task concurrency optimized system-level description. In one embodiment of the invention, the description is includes a “grey-box” description of the essentially digital system.

Abstract: A system and method of designing digital system. One aspect of the invention includes a method for designing an essentially digital system, wherein Pareto-based task concurrency optimization is performed. The method uses a system-level description of the functionality and timing of the digital system. The system-level description comprises a plurality of tasks. Task concurrency optimization is performed on said system-level description, thereby obtaining a task concurrency optimized system-level description, including Pareto-like task optimization information. The essentially digital system is designed based on said task concurrency optimized system-level description. In one embodiment of the invention, the description is includes a “grey-box” description of the essentially digital system.

Abstract: An interface device for manipulating the data inside a memory or for assisting in manipulating the data between the memory and a nearby processor is disclosed. The device is a programmable core, having a limited instruction set designed for data layout transformations, pointer-chasing and data congregation/distribution. It is attached to the memory on which it performs data manipulations. One embodiment includes an interfacing device, comprising programmable hardware configured to handle information by providing burst type information transfers to assist data communication or access.

Abstract: Methods, apparatus and software products are described for design-time data-assignment techniques for hierarchical memories, e.g., multi-banked memories in an essentially digital system as well as methods, apparatus and software products for run-time memory management techniques of such a system. Memory assignment techniques are described for assigning data to a hierarchical memory particularly for multi-tasked applications where data of dynamically created/deleted tasks is allocated at run-time. The energy consumption of hierarchical memories such as multi-banked memories depends largely on how data is assigned to the memory banks. Methods, apparatus and software products are described for design-time data-assignment techniques for hierarchical memories, e.g., multi-banked memories in an essentially digital system which improve a cost function such as energy consumption.

Abstract: A system and method of designing digital system. One aspect of the invention includes a method for designing an essentially digital system, wherein Pareto-based task concurrency optimization is performed. The method uses a system-level description of the functionality and timing of said digital system, wherein the system-level description comprises a plurality of tasks. Task concurrency optimization is performed on said system-level description, thereby obtaining a task concurrency optimized system-level description, including Pareto-like task optimization information. The essentially digital system is designed based on said task concurrency optimized system-level description. In one embodiment of the invention, the description is includes a “grey-box” description of the essentially digital system.

Abstract: A dust and fiber control device for paper making apparatus is described. The device includes a wall in conjunction with a feed spout for providing a water curtain. The water curtain serves to capture and remove air suspended dust and fiber particles from ambient air. The device is positioned transversely to the motion of a paper web underneath the web between a drying cylinder and a rewinder. The water curtain device is utilized in conjunction with air flow devices for assisting in controlling the collection of air suspended dust and fiber particles from the ambient air.

Abstract: A method for drying a cellulose web, in particular a moist paper web evincing a dry-state specific surface weight of between 10 and 80 g/m.sup.2 and initially a solids content between 8 and 30% approximately, and including supporting the web on a permeable conveying fabric and having a high-speed flow of hot air pass through the web, is characterized in that the flow of air is generated by a relative negative pressure of 100 to 500 mbars generated underneath the fabric.