Abstract: A radially deployable flexible preform which, after deploying, forms a tubular structure that is curable by polymerization after positioning it in a well or in a line and moulds to the shape thereof after curing, comprises in its constitution at least one resin comprising in its chemical formula, at least one reactive multiple bond that is capable of subsequent reaction with compounds comprising in their constitution at least one terminal reactive multiple bond or a reactive multiple bond positioned at one end or the other of the molecular chain and/or on a pendant group. The long latent period heat curing resin has a glass transition temperature of at least 90° C. and can be associated with at least one polymerizable oligomer and/or at least one monomer comprising at least one multiple bond in its chemical formula. The resin can also be associated with drying reducers or flow regulators ensuring optimum retention of the fiber/matrix ratio during pressing occurring on deployment of the expandable preform.

Abstract: A thermosetting composition with a glass transition temperature of at least 100° C. comprises at least one epoxy resin formed from at least one polyepoxide containing at least two epoxy groups in its molecule and at least one aromatic polyamine containing at least two primary amino groups in its molecule, at least one alkanoyl substituent containing 1 to 12 carbon atoms located in the position alpha to one of the amino groups. The molar ratio of the amine to the epoxide is such that each amine group corresponds to 1.6 to 2.6 epoxy groups. The composition also includes a flow controller. The composition can be used as a protective coating for any metallic or non metallic surface. The invention also concerns a flexible deployable preform comprising the composition.

Abstract: The present invention relates to a method of manufacturing a part made of a composite material comprising reinforcing fibers embedded in a matrix made of a polymerizable and/or crosslinkable material, wherein:

Abstract: A radially deployable flexible preform which, after deploying, forms a tubular structure that is curable by polymerization after positioning it in a well or in a line and moulds to the shape thereof after curing, comprises in its constitution at least one resin comprising in its chemical formula, at least one reactive multiple bond that is capable of subsequent reaction with compounds comprising in their constitution at least one terminal reactive multiple bond or a reactive multiple bond positioned at one end or the other of the molecular chain and/or on a pendant group. The long latent period heat curing resin has a glass transition temperature of at least 90° C. and can be associated with at least one polymerisable oligomer and/or at least one monomer comprising at least one multiple bond in its chemical formulae.

Abstract: A thermosetting composition with a glass transition temperature of at least 100° C. comprises at least one epoxy resin formed from at least one polyepoxide containing at least two epoxy groups in its molecule and at least one aromatic polyamine containing at least two primary amino groups in its molecule, at least one alkyl substituent containing 1 to 12 carbon atoms located in the position alpha to one of the amino groups. The molar ratio of the amine to the epoxide is such that each amine group corresponds to 1.6 to 2.6 epoxy groups. The composition also includes a flow regenerator. The composition can be used as a protective coating for any metallic or non metallic surface. The invention also concerns a flexible deployable preform comprising the composition.

Abstract: Thermosetting compositions with improved latency are obtained by addition of a molten aromatic polyamine type curing agent to a liquid epoxy resin followed by cooling the mixture, causing the curing agent to form a suspension of fine particles in the epoxy resin by recrystallisation thereof. The compositions obtained can be used for the manufacture of prepregs with high latency for their use in processes requiring intermediate steps at 80.degree. C. over several hours.

Abstract: Thermosetting compositions with improved latency are obtained by addition of a molten aromatic polyamine type curing agent to a liquid epoxy resin followed by cooling the mixture, causing the curing agent to form a suspension of fine particles in the epoxy resin by recrystallisation thereof. The compositions obtained can be used for the manufacture of prepregs with high latency for their use in processes requiring intermediate steps at 80.degree. C. over several hours.

Abstract: Polyimide precursor compositions incorporating at least one compound of fula (1), at least one compound of formula (2), at least one compound of formula (3) and at least one compound of formula (4) ##STR1## in which one of the groups R.sup.3 and R.sup.4 represents a hydrogen atom and the other, in the same way as the groups R.sup.1 and R.sup.2, which can be the same or different, in each case represent a hydrocarbon group having 1 to 16 carbon atoms, m is a number between 5 and 20, n is an integer between 1 and 5 and R.sup.5 represents a hydrogen atom, a halogen atom, a hydrocarbon group with 1 to 16 carbon atoms, or a group of formula R.sup.6 --O-- in which R.sup.6 represents a hydrocarbon group having 1 to 16 carbon atoms. The preferred composition contains 30 to 70% by weight of dry matter of compounds of formulas (1), (2) and (3), in which the groups R.sup.1, R.sup.2 and one of the groups R.sup.3 and R.sup.4 is a methyl or ethyl group and the compound of formula (4) is benzyl alcohol.

Abstract: Adhesive compositions are described comprising at least an arylaliphatic olyimide with ether chain formations, obtained by the polycondensation reaction of a tetracarboxylic aromatic acid or of one of its derivatives with at least two primary diamines, one of these diamines consisting of a polyether chain ending with the two amine functional groups and at least an epoxy resin possessing more than one epoxy group per molecular.These adhesive compositions can be used particularly for the gluing of films of polymers to thin metal sheets.

Abstract: Aromatic polyimide compositions, useful in particular for manufacturing adhesive materials, varnishes and films withstanding high temperatures, having a high solubility in organic solvents, particularly polar solvents and which are manufactured by reacting, in such a solvent, a tetraester or diacid-diester of benzhydrol 3,3', 4, 4' tetracarboxylic acid with an aromatic diamine for a sufficient time to obtain a polycondensation reaction product having an inherent viscosity at 30.degree. C., at a concentration of 5 g/liter in N-methyl pyrrolidone, ranging from 0.1 to 2 dl/g.