Abstract: A multiple-chip probe assembly suitable for wafer testing over a wide temperature range includes a plurality of individual buckling beam probe elements. A support structure supports the plurality of buckling beam probe elements in an arrangement in accordance with an electrical contact footprint for use in electrically contacting multiple chips of a wafer under test and enables buckling movement in a contacting direction of the plurality of buckling beams. The support structure includes a principal support material having a thermal coefficient of expansion (TCE) matched with the wafer under test and a second material other than the principal support material, wherein a contact positioning of the plurality of buckling beam probe elements upon the wafer under test during a testing operation is maintained. The second material prevents an individual probe element from electrically contacting the principal support material.

Abstract: A socket assembly designed to hold an IC module during testing or burn-in is described. The apparatus includes: a base, an integrated or a modular interposer, a printed circuit board, and an optional stiffener. The interposer is provided with an array of contacts to provide electrical signals to the IC module. The base upon which the module rests is provided with a plate having holes that match the contacts in the interposer. Two jaws, positioned on opposite sides of the socket, are attached to shafts which limit the jaws to a vertical movement. The jaws are further controlled by a U-shaped actuation lever, which ends are connected to off-center cams pinned to the jaws. The jaws are able to move up sufficiently to enable the module to be inserted without requiring added lateral motion. When the socket is in a closed position, the jaws urge the module against the electrical contacts. The design accommodates variable module thicknesses, and is further designed to optimize the forced convective cooling effect.