Abstract: A system and method for forming an embedded chip package is disclosed. The embedded chip package includes a first chip portion having a plurality of pre-patterned re-distribution layers joined together to form a pre-patterned lamination stack, with the pre-patterned lamination stack having a die opening extending therethrough. The embedded chip package also includes a die positioned in the die opening and a second chip portion having at least one uncut re-distribution layer, with the second chip portion affixed to each of the first chip portion and the die and being patterned to be electrically connected to both of the first chip portion and the die.

Abstract: A system and method for forming an embedded chip package is disclosed. The embedded chip package includes a first chip portion having a plurality of pre-patterned re-distribution layers joined together to form a pre-patterned lamination stack, with the pre-patterned lamination stack having a die opening extending therethrough. The embedded chip package also includes a die positioned in the die opening and a second chip portion having at least one uncut re-distribution layer, with the second chip portion affixed to each of the first chip portion and the die and being patterned to be electrically connected to both of the first chip portion and the die.

Abstract: A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.

Abstract: Embodiments of the invention include a deposition machine that allows for continuous deposition of an object or substrate with a coating having a graded composition. The deposition machine includes a deposition chamber separated into a plurality of chamber areas by a baffle having an opening. The opening allows for migration of deposition material from one chamber area to another, allowing for a graded composition coating to be deposited on the object or substrate. Other embodiments include a system for forming an electronic device and a system and method for forming a graded composition on an object.

Abstract: A composite article comprises two polymeric substrate layers, each of which has at least a diffusion-inhibiting barrier on one of the surfaces. The diffusion-inhibiting barriers are disposed such that they face each other within the composite articles. Electronic devices are disposed on such composite articles to reduce the rate of diffusion of chemical species in the environment into the devices.

Abstract: An apparatus comprises a fixture comprising at least one inner member and at least one outer member. The fixture is configured to secure a film between the at least one inner member and the at least one outer member. The secured film can be further processed to give a processed film. Further, the processed film, secured in the fixture, can undergo additional manufacturing steps to produce processed articles. The apparatus and methods described herein are useful for producing a variety of articles, such as micro-electronic and opto-electronic devices.