Abstract: The present invention discloses a polyamic acid resin composition in a REACH-approved solvent system for use in wire coating applications. The polyamic acid resin composition comprises a molecular weight greater than 8,000 grams per mole, more preferably greater than 20,000 grams per mole. The REACH-approved solvent system comprising a primary REACHapproved solvent with one or more optional secondary REACH-approved co-solvents. The secondary REACH-approved co-solvent can be reactive or non-reactive with dianhydride. The present invention also discloses the elimination of solvents in polyamic acid resin to produce a REACH-approved polyamic acid resin powder.

Abstract: The present invention relates to electrically conductive polyimide films having dispersed in them electrically conductive polymer particles having an average particle size from 0.5 to 5.0 microns. These films are suitable as image transfer belts in high-speed color copying machines and possess a surface smoothness, Ra factor (microns), between 0.5 and 1.5 and a gloss factor between 70 and 120.

Abstract: In electronic devices, heat removal is an important consideration of any device designer. Thermally conductive, high-temperature polyimide composites are disclosed herein which are generally useful as a dielectric layer in an electronic device, or a precursor metal-laminate, where the dielectric is layered on one side (or on both sides) with a metal. The polyimide composites of the present invention contain dispersed therein thermally conductive filler particles at a weight percent between 40 and 85 % weight percent. These film composites have good dielectric strength, good thermal conductivity, and optionally good adhesivity.

Abstract: In electronic devices, heat removal is an important consideration of any device designer. Thermally conductive, high-temperature polyimide composites are disclosed herein which are generally useful as a dielectric layer in an electronic device, or a precursor metal-laminate, where the dielectric is layered on one side (or on both sides) with a metal. The polyimide composites of the present invention contain dispersed therein thermally conductive filler particles where the polyimide is derived in part from a polysiloxane diamine. These film composites have good mechanical elongation, good dielectric strength, and optionally good adhesivity (i.e. laminatability) (i.e. laminatability) and low modulus, while also possessing good thermal conductivity.

Abstract: The present invention relates to electrically conductive polyimide films having dispersed in them electrically conductive polymer particles having an average particle size from 0.5 to 5.0 microns. These films are suitable as image transfer belts in high-speed color copying machines and possess a surface smoothness, Ra factor (microns), between 0.5 and 1.5 and a gloss factor between 70 and 120.