Patents by Inventor Paul Moehle

Paul Moehle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for filling resealable bags
    Patent number: 8684045
    Abstract: A means for retaining a resealable bag in an open position for filling purposes is described which includes a surround having an interior dimension less than a nominal width of one side of an unfilled and sealed bag. A pair of cut-outs formed into the surround are shaped and sized to guide edges of a bag during insertion into the surround, retain the upper corners of the bag to prevent axial movement of the bag once inserted, and bias the mouth of the bag in a open position to receive contents.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: April 1, 2014
    Inventor: Russell Paul Moehle
  • Palladium-Spot Leadframes for High Adhesion Semiconductor Devices and Method of Fabrication
    Publication number: 20070243665
    Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
    Type: Application
    Filed: June 15, 2007
    Publication date: October 18, 2007
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Donald Abbott, Michael Mitchell, Paul Moehle, Douglas Romm
  • Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
    Publication number: 20060001132
    Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
    Type: Application
    Filed: August 25, 2005
    Publication date: January 5, 2006
    Inventors: Donald Abbott, Michael Mitchell, Paul Moehle, Douglas Romm