Abstract: A flat-panel display is hermetically sealed by a process in which a first plate structure (30) is positioned generally opposite a second plate structure (32) such that sealing material (34) provided over the second plate structure lies between the plate structures. In a gravitational sealing technique, the first plate structure is positioned vertically below the second plate structure. The sealing material is heated so that it moves vertically downward under gravitational influence to meet the first plate structure and seal the plate structures together. In a global-heating gap-jumping technique, the plate structures and sealing material are globally heated to cause the sealing material to jump a gap between the sealing material and the first plate structure. When the first plate structure is positioned vertically above the second plate structure, the sealing material moves vertically upward to meet the first plate structure and close the gap.

Abstract: An external cavity laser in a hermetically sealed container and methods for hermetically sealing the external cavity laser. The external cavity laser may be tunable by various mechanisms to allow transmission at multiple selectable wavelength channels.

Abstract: A flat-panel display is hermetically sealed by a process in which a first plate structure (30) is positioned generally opposite a second plate structure (32) such that sealing material (34) provided over the second plate structure lies between the plate structures. In a gravitational sealing technique, the first plate structure is positioned vertically below the second plate structure. The sealing material is heated so that it moves vertically downward under gravitational influence to meet the first plate structure and seal the plate structures together. In a global-heating gap-jumping technique, the plate structures and sealing material are globally heated to cause the sealing material to jump a gap between the sealing material and the first plate structure. When the first plate structure is positioned vertically above the second plate structure, the sealing material moves vertically upward to meet the first plate structure and close the gap.

Abstract: A method for attaching a faceplate and a backplate of a field emission display device. Specifically, one embodiment of the present invention discloses a method for protecting a silicon nitride passivation layer from reacting with a glass frit sealing material that contains lead oxide during an oven sealing or laser sealing process. The passivation layer protects row and column electrodes in the display device. A barrier material fully encapsulates the silicon nitride passivation layer. In one embodiment, silicon dioxide is the barrier material. In another embodiment, spin-on-glass is the barrier material. In still another embodiment, cermet is the barrier material.

Abstract: A tuned sealing material and a method for attaching a first surface to a second surface using the tuned sealing material are disclosed. In one embodiment, the present invention applies a tuned sealing material between a first surface and a second surface. In this embodiment, the tuned sealing material is comprised of a combination of a filler material and a glass material. Furthermore, in this embodiment, the filler material is tuned to absorb electromagnetic radiation of a selected frequency. Next, in the present embodiment, the tuned sealing material is subjected to the electromagnetic radiation of the selected frequency. As a result of tuning the filler material, the tuned sealing material absorbs the electromagnetic radiation of the selected frequency. After absorbing the electromagnetic radiation of the desired frequency, the tuned sealing material is used to attach the first surface and the second surface.

Abstract: An external cavity laser in a hermetically sealed container and methods for hermetically sealing the external cavity laser. The external cavity laser may be tunable by various mechanisms to allow transmission at multiple selectable wavelength channels.

Abstract: A pair of plate structures (40 and 44), such as a baseplate structure and a faceplate structure of a flat-panel display, are sealed to each other by first attaching the plate structures to each other, typically at multiple attachment locations, in a non-vacuum environment. The plate structures are then hermetically sealed to each other, typically through an outer wall (44) or/and typically by gap jumping, in a vacuum environment.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: An electron-emitting device is fabricated by a process in which particles (46) are distributed over an initial structure. The particles are utilized in defining primary openings (52, 64, or 78) that extend through a primary layer (50A, 62A, or 72) provided over a gate layer (48A, 60A, or 60B) formed over an insulating layer (44) and in defining corresponding gate openings (54, 66, or 80) that extend through the gate layer. The insulating layer is etched through the primary and gate openings to form corresponding dielectric openings (56 or 68) through the insulating layer down to a lower non-insulating region (42). Electron-emissive elements (58A or 70A) are formed over the lower non-insulating region so that each electron-emissive element is at least partially situated in one dielectric opening.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: Portions (40 and 44) of a structure, such as a flat-panel device, are sealed together by a gap-jumping technique in which a sealing area (40S) of one portion is positioned near a matching sealing area (44S) of another portion such that a gap (48) at least partially separates the two sealing areas. The gap typically has an average height of 25 .mu.m or more. With the two portions of the structure so positioned, energy is initially transferred locally to material of a specified one of the portions along part of the gap while the two portions are in a non-vacuum environment to cause material of the two portions to bridge that part of the gap and partially seal the two portions together along the sealing areas.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a wall which is held in place by a structure formed either on the faceplate or on the backplate. In one embodiment the supporting structure is formed by two adjacent walls that form a slot which mechanically restrains the wall. In another embodiment a slot is formed within the faceplate and the walls of the slot mechanically restrain the wall. In one embodiment wall segments are inserted into supporting structures that mechanically restrain each wall segment. In another embodiment a UV curable or a heat curable adhesive is used to maintain walls in their proper alignment and position. In yet another embodiment a conductive material is melted so as to bond conductive lines located on the wall and conductive lines located on the faceplate.

Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a sealed interior region. The seal material is placed between a faceplate and a backplate. The seal material is heated using microwave energy. The microwave energy melts the seal material, forming a sealed interior region. The flat panel display is evacuated using an evacuation device that is then sealed off. This results in a flat panel display that is hermetically sealed.

Abstract: A gated electron-emitter having a lower non-insulating emitter region (42), an overlying insulating layer (44), and a gate layer (48A, 60A, 60B, 120A, or 180A/184) is fabricated by a process in which particles (46) are distributed over the insulating layer, the gate layer, a primary layer (50A, 62A, or 72) provided over the gate layer, a further layer (74) provided over the primary layer, or a pattern-transfer layer (182). The particles are utilized in defining gate openings (54, 66, 80, 122, or 186/188) through the gate layer. Spacer material is provided along the edges of the gate openings to form spacers (102A, 110A, 124A, 140, or 150B). Dielectric openings (80, 114, 128, 144, or 154) are formed through the insulating layer. The dielectric openings can be created before or after creating the spacers.

Abstract: A gated electron-emitter having a lower non-insulating emitter region (42), an overlying insulating layer (44), and a gate layer (48A, 60A, 60B, 120A, or 180A/184) is fabricated by a process in which particles (46) are distributed over the insulating layer, the gate layer, a primary layer (50A, 62A, or 72) provided over the gate layer, a further layer (74) provided over the primary layer, or a pattern-transfer layer (182). The particles are utilized in defining gate openings (54, 66, 80, 122, or 186/188) through the gate layer. Spacer material is provided along the edges of the gate openings to form spacers (110A, 124A, 140, or 150B) but leave corresponding apertures (112A, 126A, 142, or 152) through the spacer material. The insulating layer is etched through the apertures to form dielectric openings (114, 128, 144, or 154) through the insulating layer. Emitter material is introduced into the dielectric openings to form electron-emissive elements (116B, 130A, 146A, or 156B) typically filamentary in shape.

Abstract: A gated electron-emitter is fabricated by a process in which particles (26) are deposited over an insulating layer (24). Gate material is provided over the insulating layer in the space between the particles after which the particles and any overlying material are removed. The remaining gate material forms a gate layer (28A or 48A) through which gate openings (30 or 50) extend at the locations of the removed particles. When the gate material deposition is performed so that part of the gate material extends into the spaces below the particles, the gate openings are beveled. The insulating layer is etched through the gate openings to form dielectric openings (32 or 52). Electron-emissive elements (36A or 56A) are formed in the dielectric openings. This typically involves introducing emitter material through the gate openings into the dielectric openings and using a lift-off layer (34), or an electrochemical technique, to remove excess emitter material.

Abstract: A structure, such as a flat-panel device, is sealed together by a gap-jumping technique in which an edge (44S) of a wall (44) is positioned near a matching sealing area (40S) of a plate structure (40) such that a gap (48) at least partially separates the edge of the wall from the sealing area of the plate structure. The gap usually has an average height of 25 .mu.m or more. Energy is then transferred locally to material of the wall along the gap to cause material of the wall and the plate structure to bridge the gap and seal the plate structure to the wall. The energy-transferring step is typically performed with light energy provided by a laser (56). Local energy transfer can also be utilized to tack the plate structure to the wall at multiple spaced-apart locations (44A) along the wall. The tacking operation is typically performed as a preliminary step to sealing the plate structure to the wall.