Patents by Inventor Paul N. Zuidema
Paul N. Zuidema has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 6879486Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g, lower) opposite side of that source.Type: GrantFiled: February 14, 2002Date of Patent: April 12, 2005Assignee: Mercury Computer Systems, Inc.Inventors: Randall G. Banton, Don W. Blanchet, John R. Freeburn, Jr., Jason E. Bardo, Mike W. Gust, Paul N. Zuidema
-
Patent number: 6781831Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source.Type: GrantFiled: February 14, 2002Date of Patent: August 24, 2004Assignee: Mercury Computer Systems, Inc.Inventors: Randall G. Banton, Don W. Blanchet, Jason E. Bardo, Mike W. Gust, Paul N. Zuidema
-
Patent number: 6759588Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source.Type: GrantFiled: February 14, 2002Date of Patent: July 6, 2004Assignee: Mercury Computer Systems, Inc.Inventors: Randall G. Banton, Don W. Blanchet, John R. Freeburn, Jr., Jason E. Bardo, A. Gregory Rocco, Jr., Mike W. Gust, Paul N. Zuidema
-
Patent number: 6697255Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source.Type: GrantFiled: February 14, 2002Date of Patent: February 24, 2004Assignee: Mercury Computer Systems, Inc.Inventors: Randall G. Banton, Don W. Blanchet, Jason E. Bardo, Mike W. Gust, Paul N. Zuidema
-
Patent number: 6690575Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source.Type: GrantFiled: February 14, 2002Date of Patent: February 10, 2004Assignee: Mercury Computer Systems, Inc.Inventors: Randall G. Banton, Don W. Blanchet, John R. Freeburn, Jr., Jason E. Bardo, A. Gregory Rocco, Jr., Mike W. Gust, Paul N. Zuidema
-
Patent number: 6683787Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration.Type: GrantFiled: February 14, 2002Date of Patent: January 27, 2004Assignee: Mercury Computer Systems, Inc.Inventors: Randall G. Banton, Don W. Blanchet, Jason E. Bardo, Mike W. Gust, Paul N. Zuidema
-
Patent number: 6661657Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source.Type: GrantFiled: February 14, 2002Date of Patent: December 9, 2003Assignee: Mercury Computer Systems, Inc.Inventors: Randall G. Banton, Don W. Blanchet, John R. Freeburn, Jr., Jason E. Bardo, Mike W. Gust, Paul N. Zuidema