Abstract: The invention is an improved electrooptic assembly which comprises an electrooptic device mounted on a header and enclosed by a cover with a light-transmissive window mounted therein. The header includes a base plate with two major surfaces and a minor surface connecting the major surfaces with a segment of the cover attached to the minor surface. The minor surface is non-perpendicular to the major surfaces, thus allowing adjustment of the position of the window to achieve optimum emission or detection.

Abstract: A light emitting assembly comprising a light emitting device, an optical fiber and an optical coupling medium which is contacted to both a facet of the light emitting device and an end face of the fiber and whose maximum diameter is comparable to the diameter of the end face of the fiber. The invention is also a method of making this light emitting assembly which comprises positioning the end face of the optical fiber adjacent to the emitting portion of the facet, interposing an optical coupling medium between the facet and the end face of the fiber and increasing the space between the facet and the end face of the fiber until the maximum amount of light is coupled into the fiber.

Abstract: The invention is an improved method of fabricating a semiconductor laser which comprises bonding an electrically conducting sheet to a metallized surface of a strip of semiconductor material prior to separating the strip into one or more laser chips. The invention provides a simplified method of fabricating a laser having reduced resistive heating in the contact and improved uniformity of electrical current flow.

Abstract: An improved semiconductor injection laser diode array having reduced interaction between the elements of the array. The array comprises a substrate, an active layer and a capping layer with a separate electrical contact to the capping layer for each element of the array and a common electrical contact to the substrate. The reduced interaction is obtained by regions of higher electrical conductivity extending through the substrate towards the p-n junction from those portions of the substrate surface opposed to the contacts to the capping layer and by separate electrical contacts to each of these higher conductivity regions. The higher conductivity regions provide a lower resistivity path for current flowing through the p-n junction, thus reducing current spreading.

Abstract: An article having two parts bonded together includes an intermediate member between opposed surfaces of the two parts. The intermediate member has a plurality of openings therethrough which are filled with a bonding material. The opposed surfaces of the two parts engage opposed surfaces of the intermediate member and the bonding material is adhered to the opposed surfaces of the two parts to bond them together. The intermediate member provides control of the spacing between the two parts and the positional relationship of the two parts.

Abstract: A fiber-optic face plate is mounted across the light emitting surface of an electroluminescent semiconductor element so that the light emitted from the semiconductor element passes through the face plate. The electroluminescent semiconductor element may be enclosed in a housing with the face plate extending across and being hermetically sealed to an end of the housing.

Abstract: An electroluminescent semiconductor element is mounted in a housing with an optical fiber extending from the semiconductor element through an opening in the housing and projecting slightly beyond the housing. A plastic material completely surrounds the projecting portion of the optical fiber except for the adjacent end surface of the fiber. The plastic material secures the fiber to the housing, rigidly supports the projecting end portion of the fiber, and seals the opening in the housing through which the fiber extends. The end surface of the fiber is polished to permit emission of light emanating from the semiconductor element.

Abstract: Mounted on the metallic base member of a radiation emitter-detector package is a mounting block having a first projection, and a second projection spaced from the first projection. A radiation detector is on the first projection and a semiconductor electroluminescent device, i.e., a radiation emitter, is on the second projection such that the plane of the recombination region of the electroluminescent device is substantially perpendicular to the radiation incident surface of the radiation detector. The electroluminescent device is of the type having a primary emission and a secondary emission in a direction different from the primary emission. A radiation emitter-detector package as described is ideally suited to those applications wherein the secondary radiation of the electroluminescent device is fed into a feedback circuit regulating the biasing current of the electroluminescent device.