Patents by Inventor Paul O. Johnson

Paul O. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12082934
    Abstract: The present disclosure generally relates to methods and systems for generating a void profile for user void events. The method includes receiving by a processing element a plurality of outputs from a fluid level sensor corresponding to a plurality of levels of fluid flowing through a voiding device during a flow event; determining by the processing element a beginning and an end time of the fluid flow into the voiding device during the flow event; analyzing the plurality of outputs of the fluid level sensor over a time interval defined by the beginning and end time of the fluid flow to determine at least one of a fluid flow rate data and an accumulated volume data for the fluid flowing through the voiding device; and storing the fluid flow rate data and the accumulated flow volume data in a memory.
    Type: Grant
    Filed: September 11, 2023
    Date of Patent: September 10, 2024
    Assignee: ClearTrac Technologies, LLC
    Inventors: Brent Laing, John Green, Paul R. Johnson, Robert John Smith, Robert Edwin Schneider, Magnus Hargis, Elise Geolat Edson, Elizabeth A. O'Brien
  • Patent number: 10005975
    Abstract: A fuel separation method by which auxiliary fuel is separated from blended gasoline fuel for a flexible fuel vehicle capable of using ethanol-blended gasoline fuel, the method including the following steps (a) and (b): (a) a step in which, when the ethanol concentration is low, the blended gasoline fuel is separated by a polar separating membrane member at a relatively high separation temperature to obtain, at the permeation side of the membrane, a first auxiliary fuel enriched with the aromatic gasoline components and ethanol component, and (b) a step in which, when the ethanol concentration is high, the blended gasoline fuel is separated by a polar separating membrane member at a relatively low second separation temperature to obtain, at the permeation side of the membrane, a second auxiliary fuel enriched with the non-aromatic high-volatile gasoline components.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: June 26, 2018
    Assignees: Toyota Jidosha Kabushiki Kaisha, Exxonmobil Research and Engineering Company, Corning Incorporated
    Inventors: Yoshihiro Iwashita, Takanori Ueda, Randall D. Partridge, Robert Lucchesi, Paul O. Johnson, George L. Kellogg
  • Publication number: 20150353853
    Abstract: A fuel separation method by which auxiliary fuel is separated from blended gasoline fuel for a flexible fuel vehicle capable of using ethanol-blended gasoline fuel, the method including the following steps (a) and (b): (a) a step in which, when the ethanol concentration is low, the blended gasoline fuel is separated by a polar separating membrane member at a relatively high separation temperature to obtain, at the permeation side of the membrane, a first auxiliary fuel enriched with the aromatic gasoline components and ethanol component, and (b) a step in which, when the ethanol concentration is high, the blended gasoline fuel is separated by a polar separating membrane member at a relatively low second separation temperature to obtain, at the permeation side of the membrane, a second auxiliary fuel enriched with the non-aromatic high-volatile gasoline components.
    Type: Application
    Filed: January 18, 2013
    Publication date: December 10, 2015
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, CORNING INCORPORATED, EXXONMOBIL RESEARCH AND ENGINEERING COMPANY
    Inventors: Yoshihiro IWASHITA, Takanori UEDA, Randall D. PARTRIDGE, Robert LUCCHESI, Paul O. JOHNSON, George L. KELLOGG
  • Patent number: 6996322
    Abstract: The invention is directed to a dispersion compensation module of extremely simple design that does not rely on a spool-and-hub or similar device for holding the optical fiber used in the module, such module being here termed a “Free-Fiber dispersion compensation module”. In the inventive dispersion compensation module the optical fiber therein is in a relaxed coiled configuration having minimal tension. It has also been discovered that while coil tension is relieved by removing it from the winding spool prior to placing it in the dispersion compensation module, the tension can be further relieved by coating the coiled fiber with a finely powdered substance which will not react with or otherwise harm or damage wither the fiber or the module containing it, for example, talcum powder.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: February 7, 2006
    Assignee: Corning Incorporated
    Inventors: Kevin W. Bennett, Paul O. Johnson, Paul C. Trifoso, Todd M. Wetherill
  • Publication number: 20040146265
    Abstract: The invention is directed to a dispersion compensation module of extremely simple design that does not rely on a spool-and-hub or similar device for holding the optical fiber used in the module, such module being here termed a “Free-Fiber dispersion compensation module”. In the inventive dispersion compensation module the optical fiber therein is in a relaxed coiled configuration having minimal tension. It has also been discovered that while coil tension is relieved by removing it from the winding spool prior to placing it in the dispersion compensation module, the tension can be further relieved by coating the coiled fiber with a finely powdered substance which will dot react with or otherwise harm or damage wither the fiber or the module containing it. For example, talcum powder.
    Type: Application
    Filed: November 20, 2003
    Publication date: July 29, 2004
    Inventors: Kevin W. Bennett, Paul O. Johnson, Paul C. Trifoso, Todd M. Wetherill
  • Patent number: 6352195
    Abstract: A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: March 5, 2002
    Assignee: RF Monolithics, Inc.
    Inventors: Frank E. Guthrie, Paul O. Johnson
  • Patent number: 6270688
    Abstract: A method of polishing ferroelectric materials and specifically perovskite materials and still more specifically barium strontium titanate (1) wherein the surface (5) to be polished is initially partially smoothened or planarized by mechanical abrading with final smoothening or planarization provided by a chemical polishing with a polishing wheel using an acidic solution containing essentially the acid, hydrogen peroxide and water. Preferred acids are perchloric acid, acetic acid, nitric acid and combinations thereof.
    Type: Grant
    Filed: April 7, 1994
    Date of Patent: August 7, 2001
    Assignee: Raytheon Company
    Inventors: James F. Belcher, Howard R. Beratan, Paul O. Johnson
  • Patent number: 6119920
    Abstract: A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: September 19, 2000
    Assignee: RF Monolithics, Inc.
    Inventors: Frank E. Guthrie, Paul O. Johnson
  • Patent number: 5604977
    Abstract: A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 25, 1997
    Assignee: Texas Instruments Incorporated
    Inventors: James E. Robinson, James F. Belcher, Howard R. Beratan, Steven N. Frank, Charles M. Hanson, Paul O. Johnson, Robert J. S. Kyle, Edward G. Meissner, Robert A. Owen, Gail D. Shelton, William K. Walker
  • Patent number: 5457318
    Abstract: A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
    Type: Grant
    Filed: April 29, 1994
    Date of Patent: October 10, 1995
    Assignee: Texas Instruments Incorporated
    Inventors: James E. Robinson, James F. Belcher, Howard R. Beratan, Steven N. Frank, Charles M. Hanson, Paul O. Johnson, Robert J. S. Kyle, Edward G. Meissner, Robert A. Owen, Gail D. Shelton, William K. Walker