Patents by Inventor Paul Ortiz
Paul Ortiz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12362437Abstract: Provided are multilayered flexible interconnect circuits comprising multiple conductive layers. Also provided are methods of fabricating such circuits and also methods of fabricating battery assemblies with such circuits. A multilayered flexible interconnect circuit comprises at least two conductive layers and at least one inner insulator, which extends between these conductive layers in some circuit portions and allows for conductive layers to directly interface in other circuit portions (e.g., busbar portions). Outer insulators can be provided to insulate these conductive layers from the environment while allowing some access to these layers as needed. Each conductive layer and insulator can be individually patterned to achieve these functions. One or more insulators support conductive layers relative to each other as well as different portions (e.g., disjoined portions) of the same conductive layer.Type: GrantFiled: October 23, 2024Date of Patent: July 15, 2025Assignee: CelLink CorporationInventors: Gabrielle Tate, Jean-Paul Ortiz, Will Findlay
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Publication number: 20250176112Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.Type: ApplicationFiled: January 30, 2025Publication date: May 29, 2025Inventors: Jean-Paul Ortiz, Malcolm Parker Brown, Casey Anderson, Will Findlay, Gabrielle Tate, Shawn D'Gama, Arturo Cantu-Chavez
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Publication number: 20250158241Abstract: Provided are multilayered flexible interconnect circuits comprising multiple conductive layers. Also provided are methods of fabricating such circuits and also methods of fabricating battery assemblies with such circuits. A multilayered flexible interconnect circuit comprises at least two conductive layers and at least one inner insulator, which extends between these conductive layers in some circuit portions and allows for conductive layers to directly interface in other circuit portions (e.g., busbar portions). Outer insulators can be provided to insulate these conductive layers from the environment while allowing some access to these layers as needed. Each conductive layer and insulator can be individually patterned to achieve these functions. One or more insulators support conductive layers relative to each other as well as different portions (e.g., disjoined portions) of the same conductive layer.Type: ApplicationFiled: October 23, 2024Publication date: May 15, 2025Inventors: Gabrielle Tate, Jean-Paul Ortiz, Will Findlay
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Publication number: 20250024605Abstract: Described herein are methods for forming welded and soldered connections to flexible interconnect circuits and assemblies comprising such connections. An assembly can include a weldable transition unit having a transition pad and a solderable pad. The transition pad may comprise aluminum and can be welded to the aluminum conductive trace of a flexible interconnect circuit. The solderable pad can be soldered to the electrical contact of a device (e.g., a resistor, capacitor). In some examples, the weldable transition unit may comprise a stiffener mechanically connected to the transition pad to provide mechanical support of the transition pad and devices soldered to the transition pad. In some examples, the device soldered to the weldable transition unit may include one or more individual electronic components. In some examples, the device soldered to the weldable transition unit may be a printed circuit board (PCB) having solderable traces.Type: ApplicationFiled: July 12, 2024Publication date: January 16, 2025Applicant: CelLink CorporationInventors: Jean-Paul Ortiz, Michael Nguyen, Malcolm Parker Brown, Kevin Michael Coakley, Robin Gorrell, Theodore Matthew Urdea, Shawn D'Gama
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Publication number: 20240292527Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.Type: ApplicationFiled: May 6, 2024Publication date: August 29, 2024Applicant: CelLink CorporationInventors: Jean-Paul Ortiz, Malcolm Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
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Publication number: 20240250386Abstract: Systems and methods for a battery can comprise cells connected in parallel to form a group and groups of cells connected in series to form first and sub-assemblies with components suitable for multiple battery configurations. The first subassembly comprises a lower cell carrier and upper cell carrier between which the first groups of cells are disposed. The second subassembly comprises the lower cell carrier and upper cell carrier between which the second groups of cells are disposed. The flexible current collector comprises two or more conductive regions. The first and second subassemblies are connected in parallel or series to build the desired voltage or capacity of the battery. The flexible current collector is folded around the first and second subassemblies and disposed within casing to provide environmental protection to the battery, and positive and negative terminals connected to first and second conductive regions, respectively, to form positive and negative terminals of the battery.Type: ApplicationFiled: February 23, 2022Publication date: July 25, 2024Applicant: American Battery Solutions, Inc.Inventors: Erik William Anderson, Shad Alan Kelly, Michael Paul Garascia, Eric Walter Akkashian, Matthew Jon Knoche, Joshua William Payne, Jean-Paul Ortiz
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Publication number: 20240215173Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.Type: ApplicationFiled: March 5, 2024Publication date: June 27, 2024Applicant: CelLink CorporationInventors: Jean-Paul Ortiz, Malcolm Parker Brown, Casey Anderson, Will Findlay, Gabrielle Tate, Shawn D'Gama, Arturo Cantu-Chavez
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Patent number: 12010792Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.Type: GrantFiled: July 12, 2023Date of Patent: June 11, 2024Assignee: CelLink CorporationInventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
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Patent number: 11950377Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.Type: GrantFiled: April 14, 2023Date of Patent: April 2, 2024Assignee: CelLink CorporationInventors: Jean-Paul Ortiz, Malcom Parker Brown, Casey Anderson, Will Findlay, Gabrielle Tate, Shawn D'Gama, Arturo Cantu-Chavez
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Publication number: 20230371174Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.Type: ApplicationFiled: July 12, 2023Publication date: November 16, 2023Applicant: CelLink CorporationInventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
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Patent number: 11751328Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.Type: GrantFiled: February 22, 2023Date of Patent: September 5, 2023Assignee: CelLink CorporationInventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
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Publication number: 20230269870Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.Type: ApplicationFiled: February 22, 2023Publication date: August 24, 2023Applicant: CelLink CorporationInventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
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Publication number: 20220376343Abstract: Systems and methods for a battery module including a subassembly that can include cells electrically connected to form a group; and groups of cells electrically connected to form the subassembly. The subassembly can include a lower cell carrier and an upper cell carrier configured to retain a thermally insulating material, the group of cells disposed between the upper and lower cell carriers, cell alignment and retention features integrally formed with one or more of: lower or upper cell carriers, means for inhibiting propagation of thermal runaway, a current collector comprising two or more conductive regions; and positive and negative terminals electrically connected to the two or more conductive regions, respectively, to form positive and negative terminals of battery module.Type: ApplicationFiled: May 13, 2022Publication date: November 24, 2022Inventors: Erik William Anderson, Joshua William Payne, Jean-Paul Ortiz, Michael Paul Garascia, Matthew James Petraglia, Daniel-Dean Drake DeLorme, Marc Eduard Breitman, Matthew Jon Knoche, Shad Alan Kelly, Eric Walter Akkashian, Kriten Allison Swanson, Nolan Joseph Salani, Elaine Elizabeth Parkansky
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Publication number: 20220367982Abstract: An improved battery module and methods of assembly are disclosed. A battery module may include carriers for holding battery cells via interference fit. The carriers may include a busbar with a stamped fusible link between each battery cell and the busbar. The battery module may be held together via interference fit, laser welding, and friction welding. A method of assembly may electrically and mechanically connect battery cells by laser welding stamped fusible links within a busbar. The method may further enclose the battery cells within a case and create a seal between the lid and case using friction welding.Type: ApplicationFiled: May 13, 2021Publication date: November 17, 2022Inventors: Josh Payne, Matthew Knoche, Michael Paul Garascia, Jean-Paul Ortiz, Erik Anderson
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Patent number: 10493951Abstract: A motor vehicle seat restraint system may include a tongue or buckle and an electrical component carried thereby, an elongated restraint web coupled to the tongue or buckle, the restraint web having a first side and a second side opposite the first side, an outer surface between the first and second sides and an inner surface opposite the outer surface, a channel member coupled to and between the inner and outer surfaces of the restraint web adjacent to the first side of the restraint web and extending along at least a portion of a length thereof, the channel member and the first side of the restraint web defining a passageway therebetween, and one or more electrical wires operatively coupled to the electrical component and extending into and through the passageway such that the one or more electrical wires ride within the channel member along-side the restraint web.Type: GrantFiled: November 16, 2016Date of Patent: December 3, 2019Assignee: Indiana Mills & Manufacturing, Inc.Inventors: Jean Paul Ortiz, Kyle M. Paulson, P. Jason Davis
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Publication number: 20180297554Abstract: A motor vehicle seat restraint system may include a tongue or buckle and an electrical component carried thereby, an elongated restraint web coupled to the tongue or buckle, the restraint web having a first side and a second side opposite the first side, an outer surface between the first and second sides and an inner surface opposite the outer surface, a channel member coupled to and between the inner and outer surfaces of the restraint web adjacent to the first side of the restraint web and extending along at least a portion of a length thereof, the channel member and the first side of the restraint web defining a passageway therebetween, and one or more electrical wires operatively coupled to the electrical component and extending into and through the passageway such that the one or more electrical wires ride within the channel member along-side the restraint web.Type: ApplicationFiled: November 16, 2016Publication date: October 18, 2018Inventors: Jean Paul ORTIZ, Kyle M. PAULSON, P. Jason DAVIS
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Patent number: 9178859Abstract: Presented herein are authentication systems and methodologies for equipment deployed in an operational electronic network. Information about a piece of network-connected equipment is received, wherein the information includes a plurality of attribute values characterizing the equipment, wherein the information is obtained via a query to the equipment that produces, as output, the plurality of attribute values. The attribute values are compared to stored values, and when one or more of the attribute values are determined to be outside a range of the stored values, the equipment is designated as non-authentic. Non-authentic equipment may include counterfeit and grey marketed equipment.Type: GrantFiled: August 2, 2013Date of Patent: November 3, 2015Assignee: Cisco Technology, Inc.Inventors: Paul Ortiz, Shelley Raina, Samip Bhavsar
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Publication number: 20150303436Abstract: The present disclosure relates to a method of manufacturing a lead-acid battery, the method including: (i) extending a current collector from an end of a cell pack; and (ii) laser-welding a bus bar to the current collector.Type: ApplicationFiled: June 29, 2015Publication date: October 22, 2015Inventors: William Koetting, Kwak Tom, Art Holland, James Carlson, Michael Nielson, Fabio Albano, Subhash Dhar, Will Koederitz, Joshua Payne, Jorge Espinel, Jean-Paul Ortiz
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Publication number: 20150073580Abstract: Disclosed is a method of capturing unique device identifiers (“UDI”) associated with products to track movement, time, location via and into a computerized network and then combining the data with additional data outside of the product UDI related data and meta-data such as shipping, distribution, workers, date, and time. In one implementation, Such tracking may be performed in real-time to determine if a leakage or loss alarm or warning threshold has been met.Type: ApplicationFiled: September 8, 2014Publication date: March 12, 2015Inventor: Paul Ortiz
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Publication number: 20070206364Abstract: A method for forming a flexible circuit board includes placing an adhesive coated coverlay over a flexible media, placing a release film over the adhesive coated coverlay and compressing together the flexible media, the adhesive coated coverlay, and the release film. The flexible media includes circuitry. The release film includes a multi-layer film having first and second layers. The first layer includes an elastomer and the second layer includes a fluoropolymer.Type: ApplicationFiled: March 2, 2006Publication date: September 6, 2007Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATIONInventors: Gwo Swei, John Kastelic, Paul Ortiz