Patents by Inventor Paul Ortiz

Paul Ortiz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12362437
    Abstract: Provided are multilayered flexible interconnect circuits comprising multiple conductive layers. Also provided are methods of fabricating such circuits and also methods of fabricating battery assemblies with such circuits. A multilayered flexible interconnect circuit comprises at least two conductive layers and at least one inner insulator, which extends between these conductive layers in some circuit portions and allows for conductive layers to directly interface in other circuit portions (e.g., busbar portions). Outer insulators can be provided to insulate these conductive layers from the environment while allowing some access to these layers as needed. Each conductive layer and insulator can be individually patterned to achieve these functions. One or more insulators support conductive layers relative to each other as well as different portions (e.g., disjoined portions) of the same conductive layer.
    Type: Grant
    Filed: October 23, 2024
    Date of Patent: July 15, 2025
    Assignee: CelLink Corporation
    Inventors: Gabrielle Tate, Jean-Paul Ortiz, Will Findlay
  • Publication number: 20250176112
    Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.
    Type: Application
    Filed: January 30, 2025
    Publication date: May 29, 2025
    Inventors: Jean-Paul Ortiz, Malcolm Parker Brown, Casey Anderson, Will Findlay, Gabrielle Tate, Shawn D'Gama, Arturo Cantu-Chavez
  • Publication number: 20250158241
    Abstract: Provided are multilayered flexible interconnect circuits comprising multiple conductive layers. Also provided are methods of fabricating such circuits and also methods of fabricating battery assemblies with such circuits. A multilayered flexible interconnect circuit comprises at least two conductive layers and at least one inner insulator, which extends between these conductive layers in some circuit portions and allows for conductive layers to directly interface in other circuit portions (e.g., busbar portions). Outer insulators can be provided to insulate these conductive layers from the environment while allowing some access to these layers as needed. Each conductive layer and insulator can be individually patterned to achieve these functions. One or more insulators support conductive layers relative to each other as well as different portions (e.g., disjoined portions) of the same conductive layer.
    Type: Application
    Filed: October 23, 2024
    Publication date: May 15, 2025
    Inventors: Gabrielle Tate, Jean-Paul Ortiz, Will Findlay
  • Publication number: 20250024605
    Abstract: Described herein are methods for forming welded and soldered connections to flexible interconnect circuits and assemblies comprising such connections. An assembly can include a weldable transition unit having a transition pad and a solderable pad. The transition pad may comprise aluminum and can be welded to the aluminum conductive trace of a flexible interconnect circuit. The solderable pad can be soldered to the electrical contact of a device (e.g., a resistor, capacitor). In some examples, the weldable transition unit may comprise a stiffener mechanically connected to the transition pad to provide mechanical support of the transition pad and devices soldered to the transition pad. In some examples, the device soldered to the weldable transition unit may include one or more individual electronic components. In some examples, the device soldered to the weldable transition unit may be a printed circuit board (PCB) having solderable traces.
    Type: Application
    Filed: July 12, 2024
    Publication date: January 16, 2025
    Applicant: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Michael Nguyen, Malcolm Parker Brown, Kevin Michael Coakley, Robin Gorrell, Theodore Matthew Urdea, Shawn D'Gama
  • Publication number: 20240292527
    Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
    Type: Application
    Filed: May 6, 2024
    Publication date: August 29, 2024
    Applicant: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Malcolm Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
  • Publication number: 20240250386
    Abstract: Systems and methods for a battery can comprise cells connected in parallel to form a group and groups of cells connected in series to form first and sub-assemblies with components suitable for multiple battery configurations. The first subassembly comprises a lower cell carrier and upper cell carrier between which the first groups of cells are disposed. The second subassembly comprises the lower cell carrier and upper cell carrier between which the second groups of cells are disposed. The flexible current collector comprises two or more conductive regions. The first and second subassemblies are connected in parallel or series to build the desired voltage or capacity of the battery. The flexible current collector is folded around the first and second subassemblies and disposed within casing to provide environmental protection to the battery, and positive and negative terminals connected to first and second conductive regions, respectively, to form positive and negative terminals of the battery.
    Type: Application
    Filed: February 23, 2022
    Publication date: July 25, 2024
    Applicant: American Battery Solutions, Inc.
    Inventors: Erik William Anderson, Shad Alan Kelly, Michael Paul Garascia, Eric Walter Akkashian, Matthew Jon Knoche, Joshua William Payne, Jean-Paul Ortiz
  • Publication number: 20240215173
    Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.
    Type: Application
    Filed: March 5, 2024
    Publication date: June 27, 2024
    Applicant: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Malcolm Parker Brown, Casey Anderson, Will Findlay, Gabrielle Tate, Shawn D'Gama, Arturo Cantu-Chavez
  • Patent number: 12010792
    Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
    Type: Grant
    Filed: July 12, 2023
    Date of Patent: June 11, 2024
    Assignee: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
  • Patent number: 11950377
    Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 2, 2024
    Assignee: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Malcom Parker Brown, Casey Anderson, Will Findlay, Gabrielle Tate, Shawn D'Gama, Arturo Cantu-Chavez
  • Publication number: 20230371174
    Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
    Type: Application
    Filed: July 12, 2023
    Publication date: November 16, 2023
    Applicant: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
  • Patent number: 11751328
    Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: September 5, 2023
    Assignee: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
  • Publication number: 20230269870
    Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
    Type: Application
    Filed: February 22, 2023
    Publication date: August 24, 2023
    Applicant: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
  • Publication number: 20220376343
    Abstract: Systems and methods for a battery module including a subassembly that can include cells electrically connected to form a group; and groups of cells electrically connected to form the subassembly. The subassembly can include a lower cell carrier and an upper cell carrier configured to retain a thermally insulating material, the group of cells disposed between the upper and lower cell carriers, cell alignment and retention features integrally formed with one or more of: lower or upper cell carriers, means for inhibiting propagation of thermal runaway, a current collector comprising two or more conductive regions; and positive and negative terminals electrically connected to the two or more conductive regions, respectively, to form positive and negative terminals of battery module.
    Type: Application
    Filed: May 13, 2022
    Publication date: November 24, 2022
    Inventors: Erik William Anderson, Joshua William Payne, Jean-Paul Ortiz, Michael Paul Garascia, Matthew James Petraglia, Daniel-Dean Drake DeLorme, Marc Eduard Breitman, Matthew Jon Knoche, Shad Alan Kelly, Eric Walter Akkashian, Kriten Allison Swanson, Nolan Joseph Salani, Elaine Elizabeth Parkansky
  • Publication number: 20220367982
    Abstract: An improved battery module and methods of assembly are disclosed. A battery module may include carriers for holding battery cells via interference fit. The carriers may include a busbar with a stamped fusible link between each battery cell and the busbar. The battery module may be held together via interference fit, laser welding, and friction welding. A method of assembly may electrically and mechanically connect battery cells by laser welding stamped fusible links within a busbar. The method may further enclose the battery cells within a case and create a seal between the lid and case using friction welding.
    Type: Application
    Filed: May 13, 2021
    Publication date: November 17, 2022
    Inventors: Josh Payne, Matthew Knoche, Michael Paul Garascia, Jean-Paul Ortiz, Erik Anderson
  • Patent number: 10493951
    Abstract: A motor vehicle seat restraint system may include a tongue or buckle and an electrical component carried thereby, an elongated restraint web coupled to the tongue or buckle, the restraint web having a first side and a second side opposite the first side, an outer surface between the first and second sides and an inner surface opposite the outer surface, a channel member coupled to and between the inner and outer surfaces of the restraint web adjacent to the first side of the restraint web and extending along at least a portion of a length thereof, the channel member and the first side of the restraint web defining a passageway therebetween, and one or more electrical wires operatively coupled to the electrical component and extending into and through the passageway such that the one or more electrical wires ride within the channel member along-side the restraint web.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: December 3, 2019
    Assignee: Indiana Mills & Manufacturing, Inc.
    Inventors: Jean Paul Ortiz, Kyle M. Paulson, P. Jason Davis
  • Publication number: 20180297554
    Abstract: A motor vehicle seat restraint system may include a tongue or buckle and an electrical component carried thereby, an elongated restraint web coupled to the tongue or buckle, the restraint web having a first side and a second side opposite the first side, an outer surface between the first and second sides and an inner surface opposite the outer surface, a channel member coupled to and between the inner and outer surfaces of the restraint web adjacent to the first side of the restraint web and extending along at least a portion of a length thereof, the channel member and the first side of the restraint web defining a passageway therebetween, and one or more electrical wires operatively coupled to the electrical component and extending into and through the passageway such that the one or more electrical wires ride within the channel member along-side the restraint web.
    Type: Application
    Filed: November 16, 2016
    Publication date: October 18, 2018
    Inventors: Jean Paul ORTIZ, Kyle M. PAULSON, P. Jason DAVIS
  • Patent number: 9178859
    Abstract: Presented herein are authentication systems and methodologies for equipment deployed in an operational electronic network. Information about a piece of network-connected equipment is received, wherein the information includes a plurality of attribute values characterizing the equipment, wherein the information is obtained via a query to the equipment that produces, as output, the plurality of attribute values. The attribute values are compared to stored values, and when one or more of the attribute values are determined to be outside a range of the stored values, the equipment is designated as non-authentic. Non-authentic equipment may include counterfeit and grey marketed equipment.
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: November 3, 2015
    Assignee: Cisco Technology, Inc.
    Inventors: Paul Ortiz, Shelley Raina, Samip Bhavsar
  • Publication number: 20150303436
    Abstract: The present disclosure relates to a method of manufacturing a lead-acid battery, the method including: (i) extending a current collector from an end of a cell pack; and (ii) laser-welding a bus bar to the current collector.
    Type: Application
    Filed: June 29, 2015
    Publication date: October 22, 2015
    Inventors: William Koetting, Kwak Tom, Art Holland, James Carlson, Michael Nielson, Fabio Albano, Subhash Dhar, Will Koederitz, Joshua Payne, Jorge Espinel, Jean-Paul Ortiz
  • Publication number: 20150073580
    Abstract: Disclosed is a method of capturing unique device identifiers (“UDI”) associated with products to track movement, time, location via and into a computerized network and then combining the data with additional data outside of the product UDI related data and meta-data such as shipping, distribution, workers, date, and time. In one implementation, Such tracking may be performed in real-time to determine if a leakage or loss alarm or warning threshold has been met.
    Type: Application
    Filed: September 8, 2014
    Publication date: March 12, 2015
    Inventor: Paul Ortiz
  • Publication number: 20070206364
    Abstract: A method for forming a flexible circuit board includes placing an adhesive coated coverlay over a flexible media, placing a release film over the adhesive coated coverlay and compressing together the flexible media, the adhesive coated coverlay, and the release film. The flexible media includes circuitry. The release film includes a multi-layer film having first and second layers. The first layer includes an elastomer and the second layer includes a fluoropolymer.
    Type: Application
    Filed: March 2, 2006
    Publication date: September 6, 2007
    Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
    Inventors: Gwo Swei, John Kastelic, Paul Ortiz