Patents by Inventor Paul P. Bey

Paul P. Bey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8424380
    Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: April 23, 2013
    Assignee: Honeywell International Inc.
    Inventors: Scott E Beck, Paul P Bey, Jamie Speldrich, Mohammed A. Javvad Qasimi
  • Publication number: 20120192645
    Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.
    Type: Application
    Filed: March 29, 2012
    Publication date: August 2, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: SCOTT E. BECK, PAUL P. BEY, JAMIE SPELDRICH, MOHAMMED A. JAVVAD QASIMI
  • Patent number: 8161811
    Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: April 24, 2012
    Assignee: Honeywell International Inc.
    Inventors: Scott E. Beck, Paul P. Bey, Jamie Speldrich, Mohammed A. Javvad Qasimi
  • Publication number: 20110146398
    Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: SCOTT E. BECK, PAUL P. BEY, JAMIE SPELDRICH, MOHAMMED A. JAVVAD QASIMI
  • Patent number: 7832269
    Abstract: A combinational sensor system for measuring multiple measurands includes a flow transducer, a pressure transducer and a humidity transducer. The pressure and humidity transducers are provided with independent access to sensed media and are ratiometric to a supply voltage, whereas the flow sensor is sensitive to openings to the flow path. The combinational sensor system utilizes elastomeric seals that include patterned electrically conductive and non-conductive seals. An ASIC is generally associated with the combinational sensor, and is located on a patterned electrically conductive substrate lead frame or for signal conditioning in order to detect any of the sensed measurands. The transducers can be arranged in a manner that distributes the transducers to optimize the accuracy and response time of the combinational sensor system.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: November 16, 2010
    Assignee: Honeywell International Inc.
    Inventors: Paul P. Bey, Jr., Craig S. Becke, Jamie W. Speldrich, Christopher M. Blumhoff
  • Patent number: 7712347
    Abstract: A self-diagnostic measurement method to detect microbridge null drift and performance. An ASIC can be designed to include a self-diagnostic feature that automatically occurs at start up or upon command in Normal Operation whereby the temperature compensated microbridge null can be measured in a state of very low thermal energy and allows for the tracking of microbridge null stability versus time. An Airflow Combi-Sensor ASIC (Heimdal) with its strategic partner ZMD can be developed and can be implemented in the form of a self-diagnostic feature that occurs when power is first applied to the ASIC or upon command. When the self-diagnostic is initiated, power is removed and after the electronics have settled, a small power can be applied to the microbridge to measure the bridge null with reduced sensitivity to flow due to self-heating.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: May 11, 2010
    Assignee: Honeywell International Inc.
    Inventors: Lamar F. Ricks, Paul P. Bey
  • Publication number: 20090056410
    Abstract: A self-diagnostic measurement method to detect microbridge null drift and performance. An ASIC can be designed to include a self-diagnostic feature that automatically occurs at start up or upon command in Normal Operation whereby the temperature compensated microbridge null can be measured in a state of very low thermal energy and allows for the tracking of microbridge null stability versus time. An Airflow Combi-Sensor ASIC (Heimdal) with its strategic partner ZMD can be developed and can be implemented in the form of a self-diagnostic feature that occurs when power is first applied to the ASIC or upon command. When the self-diagnostic is initiated, power is removed and after the electronics have settled, a small power can be applied to the microbridge to measure the bridge null with reduced sensitivity to flow due to self-heating.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 5, 2009
    Inventors: Lamar F. Ricks, Paul P. Bey
  • Publication number: 20080314118
    Abstract: A combinational sensor system for measuring multiple measurands includes a flow transducer, a pressure transducer and a humidity transducer. The pressure and humidity transducers are provided with independent access to sensed media and are ratiometric to a supply voltage, whereas the flow sensor is sensitive to openings to the flow path. The combinational sensor system utilizes elastomeric seals that include patterned electrically conductive and non-conductive seals. An ASIC is generally associated with the combinational sensor, and is located on a patterned electrically conductive substrate lead frame or for signal conditioning in order to detect any of the sensed measurands. The transducers can be arranged in a manner that distributes the transducers to optimize the accuracy and response time of the combinational sensor system.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Inventors: Paul P. Bey, JR., Craig S. Becke, Jamie W. Speldrich, Christopher M. Blumhoff
  • Patent number: 7243541
    Abstract: A modular sensor system includes a plurality of varying types of sensors that provide multiple sensing measurands for sensing operations. A housing is generally associated with the varying types of sensors, such that the housing introduces media to be sensed by the sensors. An electrical interface can also be connected to the sensors, wherein the electrical interface permits a logical physical connection to be made to a selected sensor in order to maximize sensing sensitivity and provide a sensing repeatability and accurate sensor compensation thereof for the sensing operations.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: July 17, 2007
    Assignee: Honeywell International Inc.
    Inventors: Paul P. Bey, Anthony M. Dmytriw, Christopher M. Blumhoff, Craig S. Becke, Jamie W. Speldrich, Richard W. Gehman
  • Patent number: 5461322
    Abstract: A feedback operated DC bridge circuit for monitoring the voltage variations in a voltage divider circuit using a voltage controlled resistance component to reach a null balance across the bridge. Amplification is provided at higher accuracy near the null point when the voltage difference across the bridge is zero. The feedback bridge circuit includes an integrator which directly drives the controlling component to the value of the resistance in an unknown branch to force the null condition. The voltage controlled component (configured as a discrete metal oxide semiconductor device or bipolar junction transistor) and the balancing scheme are suitable for microfabrication and provides noise-rejection enhancement. The interconnected integral feedback of the autonulling DC bridge enables both a neural network for pre-processing sensor input in a spatial domain as well as general analog computation that mimics a first order differential equation in the form of the system state equation.
    Type: Grant
    Filed: August 6, 1993
    Date of Patent: October 24, 1995
    Assignees: Geo-Centers, Inc., Naval Research Laboratory
    Inventors: Paul P. Bey, Jr., Thomas L. Fare, David J. Yonce
  • Patent number: 5264798
    Abstract: A self-contained autonulling bridge circuit based on phase-sensitive deteon of an impedance to be measured is described. The system utilizes a feedback structure to control a variable impedance in order to establish the null of the bridge. The system utilizes a voltage-variable impedance having both resistance and capacitance and provides the phase sensitive relationship in the control means in order to provide highly accurate measurement of an unknown test impedance. The ability to measure small changes in impedance provides particularly useful application to the area of biological sensor impedance measurement or electrochemical impedance measurement using silicon-based devices.
    Type: Grant
    Filed: October 29, 1991
    Date of Patent: November 23, 1993
    Assignees: The United States of America as represented by the Secretary of the Navy, Geo-Centers, Inc.
    Inventors: Paul P. Bey, Jr., Thomas L. Fare
  • Patent number: 4194838
    Abstract: A photometric device for measuring and displaying by digital means primary color densities of a color negative to be printed to determine densities of color compensating filters. Exposure time, including reciprocity effect compensation for the photographic paper, is displayed digitally and determined by density measurements of the projected image.A reference area of a color negative illuminated by light through color compensating filters is projected on the aperture of a probe which directs light through a light guide to a photodetector. The resulting photocurrents generate voltages amplified by a first and second variable gain linear amplifier. The second amplifier provides primary color and exposure density reference by means of gains stored by measurement of a standard negative. Digital display means is provided to display memory gains for accurately modifying or resetting reference gains.
    Type: Grant
    Filed: February 22, 1977
    Date of Patent: March 25, 1980
    Inventors: Michael P. Bey, Paul P. Bey