Abstract: A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.

Abstract: A moveable micromirror includes a supporting structure, a flexible post extending from the supporting structure, and a table extending radially from the end of the post along a plane generally perpendicular to the post, the table having a reflective surface facing away from the supporting structure. The post, preferably formed of single-crystal silicon, is dimensioned to be sufficiently flexible to allow the reflective surface to be selectively moveable and positionable, with at least two degrees of freedom, when urged by a suitable actuating force. A method of making an array of moveable micromirrors of this type includes deep etching a silicon substrate so as to form posts surrounded by trenches, etching back the surface of the substrate around the posts so as to allow the posts to protrude beyond the surface of the substrate, and affixing a table with a reflective surface thereon to the tops of a plurality of the posts.

Abstract: A micro-electro-mechanical system (MEMS) optical switch actuator and method for fabricating the actuator provide an anchor assembly that functions as a second electrode. The actuator has a reflective element assembly and a first electrode assembly for moving the reflective element assembly from a first position to a second position based on a switching signal. The actuator further includes an anchor assembly coupled to the reflective element assembly such that a spring force is generated in the reflective element assembly when the reflective element assembly is in the second position. The anchor assembly is electrically conductive such that the switching signal generates an electrostatic force between the anchor assembly and the first electrode assembly. The method for fabricating the actuator includes the step of coupling a multi-level reflection assembly to an optical circuit.

Abstract: A micro-electro-mechanical system (MEMS) optical switch actuator and method for fabricating the actuator provide an anchor assembly that functions as a second electrode. The actuator has a reflective element assembly and a first electrode assembly for moving the reflective element assembly from a first position to a second position based on a switching signal. The actuator further includes an anchor assembly coupled to the reflective element assembly such that a spring force is generated in the reflective element assembly when the reflective element assembly is in the second position. The anchor assembly is electrically conductive such that the switching signal generates an electrostatic force between the anchor assembly and the first electrode assembly. The method for fabricating the actuator includes the step of coupling a multi-level reflection assembly to an optical circuit.

Abstract: Data storage media are integrated into a microfabricated data storage system. Each data storage medium is located on one surface of a movable support. Flexures connected to the movable support allow the medium to move within a plane so that data can be stored at different locations on the medium, but significantly resist any out of the plane motion of the medium. Therefore, tips or other devices for writing or reading to or from the medium can be placed a small distance from the medium, thereby facilitating microfabrication of the data storage system. First electrodes are coupled to a second surface of the movable support opposite the medium. Second electrodes are located opposite the first electrodes to form an electrostatic surface actuator. Electric fields generated by the second electrodes interact with an electric field generated by the first electrodes to apply a force to the first electrodes and, hence, the movable support and the medium.

Abstract: A moveable micromirror includes a supporting structure, a flexible post extending from the supporting structure, and a table extending radially from the end of the post along a plane generally perpendicular to the post, the table having a reflective surface facing away from the supporting structure. The post, preferably formed of single-crystal silicon, is dimensioned to be sufficiently flexible to allow the reflective surface to be selectively moveable and positionable, with at least two degrees of freedom, when urged by a suitable actuating force. A method of making an array of moveable micromirrors of this type includes deep etching a silicon substrate so as to form posts surrounded by trenches, etching back the surface of the substrate around the posts so as to allow the posts to protrude beyond the surface of the substrate, and affixing a table with a reflective surface thereon to the tops of a plurality of the posts.

Abstract: Two wafers are bonded together through an annealing process that maintains temperatures at CMOS compatible levels (i.e., below 500 degrees Celsius). A layer of palladium (Pd) is formed on a first wafer. Preferably an adhesion layer of chromium (Cr) attaches the palladium layer to the first wafer. The palladium layer is engaged with silicon (Si) from a second wafer, and the engaged wafers are annealed to form a palladium-silicide (PdSi) bond between the palladium layer of the first wafer and the silicon of the second wafer. In addition to bonding the first wafer to the second wafer, the palladium-silicon bond may be used to form an electrical connection between the two wafers so that circuits on both wafers may communicate to one another through the palladium-silicon bond.

Abstract: A palladium contact and a gasket are formed on a first wafer. The gasket and contact are simultaneously engaged with a silicon layer of a second wafer. The wafers are then heated to a temperature that both forms a bond between the palladium contact of the first wafer with the silicon layer of the second wafer and that fuses the gasket to the second wafer. Therefore, when the temperature is decreased, the palladium-silicon bond maintains the alignment of the two wafers with respect to one another, and the gasket hardens to form seal around a periphery of the two wafers. By placing the two wafers in a vacuum environment prior to engaging the two wafers, the space encompassed by the gasket and the two wafers forms a sealed vacuum during the heating process. Therefore, the heating process not only forms a palladium-silicon bond between the two wafers, but it also forms a vacuum seal around selected components included within either of the two wafers.

Abstract: A pressure regulator that sets the pressure of a liquid to a predetermined pressure differential below a reference pressure, such as atmospheric pressure. The pressure regulator comprises a liquid delivery channel and a capillary array. The liquid delivery channel includes a liquid input and a liquid output. The liquid flows through the liquid delivery channel from the liquid input to the liquid output. The capillary array is composed of ones of an elongate capillary. The capillary includes a first end in fluid communication with the liquid delivery channel and a second end in pressure communication with a source of the reference pressure. The liquid flows through the first end into the capillary to form a liquid surface in the capillary. The second end is remote from the first end.

Abstract: A thin micromechanical device is fabricated in a way that is mechanically compatible with wafer handling for conventional-thickness wafers. A removable bonding layer bonds a fabrication wafer to a substantially conventional-thickness handle wafer to form a bonded wafer pair. The micromechanical device is formed in the fabrication wafer by subjecting the bonded wafer pair to processing including wafer handling for conventional-thickness wafers. The micromechanical device is formed to include part of the fabrication wafer. Finally, the bonding layer underlying the micromechanical device is removed to release the micromechanical device from the handle wafer.

Abstract: An acoustical resonator comprising top and bottom electrodes that sandwich a PZ layer. The resonance frequency of the acoustical resonator may be adjusted after fabrication by utilizing heating elements included in the acoustical resonator and/or by adjusting the thickness of a tuning layer. In the preferred embodiment of the present invention, the electrodes comprise Mo layers. One embodiment of the present invention is constructed on a Si.sub.3 N.sub.4 membrane. A second embodiment of the present invention is constructed such that it is suspended over a substrate on metallic columns. In the preferred embodiment of the present invention, the electrodes are deposited by a method that minimizes the stress in the electrodes.