Abstract: A mounting clip can be placed and secured over the exterior surfaces of a package of an integrated optical assembly. The mounting clip includes a top panel, end clips that curl and extend down from end edges of the top panel, an interference tab that extends up from the top panel, and cap clips that curl and extend up from the top panel. The mounting clip is dimensioned such that bends in the end clips press and secure against exterior side surfaces of the package of the integrated assembly. Thus, the mounting clip can be secured to the package of the integrated assembly using an interference or friction fit. A cap on a fiber optic cable that extends from the package can be curled around and secured between the interference tab and cap clips of the mounting clip to secure it during surface mounting.

Abstract: Light-emitting devices and particularly light-emitting device assemblies that include light-emitting diodes (LEDs) as light sources are described. The methods and systems of at least some of the embodiments described herein increase the removal of thermal energy generated by the light-emitting devices.

Abstract: A mounting clip can be placed and secured over the exterior surfaces of a package of an integrated optical assembly. The mounting clip includes a top panel, end clips that curl and extend down from end edges of the top panel, an interference tab that extends up from the top panel, and cap clips that curl and extend up from the top panel. The mounting clip is dimensioned such that bends in the end clips press and secure against exterior side surfaces of the package of the integrated assembly. Thus, the mounting clip can be secured to the package of the integrated assembly using an interference or friction fit. A cap on a fiber optic cable that extends from the package can be curled around and secured between the interference tab and cap clips of the mounting clip to secure it during surface mounting.

Abstract: The present invention relates to light-emitting diodes (LEDs), and related components, processes, systems, and methods. In certain embodiments, an LED that provides improved optical and thermal efficiency when used in optical systems with a non-rectangular input aperture (e.g., a circular aperture) is described. In some embodiments, the emission surface of the LED and/or an emitter output aperture can be shaped (e.g., in a non-rectangular shape) such that enhanced optical and thermal efficiencies are achieved. In addition, in some embodiments, chip designs and processes that may be employed in order to produce such devices are described.

Abstract: A system and method for displacing the etendue value of light emitted as measured in a plane at an emission surface of a light emitting device to a second plane at determined height above the emission surface using a light coupling layer. The system and method increases light output or extraction of generated light from the light emitting device through a light coupling layer.

Abstract: The present disclosure relates to shifting a chromaticity of light generated from a light-emitting device. A light-emitting device may incorporate an optical element (e.g., filter) so that light emitted from a light-generating surface having an initial chromaticity may be altered. The optical element may shift the chromaticity of emitted light having the initial chromaticity to a final chromaticity that is different from the initial chromaticity. Thus, the chromaticity of emitted light from the manufactured LEDs that would otherwise be unacceptable for having chromaticity coordinates that fall outside of a desired chromaticity bin is shifted so as to have chromaticity coordinates that fall within suitable parameters. Accordingly, a number of the manufactured LEDs that would normally be discarded may be salvaged.

Abstract: A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area.

Abstract: Light-emitting devices, and related assemblies, systems and methods are described. Specifically, at least some of the embodiments relate to light-emitting devices including proximate switching element(s). The switching element(s) control the current, or power, supplied to the light-emitting devices.

Abstract: Light-emitting devices and particularly light-emitting device assemblies that include light-emitting diodes (LEDs) as light sources are described. The methods and systems of at least some of the embodiments described herein increase the removal of thermal energy generated by the light-emitting devices.

Abstract: One or more embodiments presented herein include a light emitting system and/or device that can include a thermal management system. The thermal management system can provide for transport and/or dissipation of heat generated by a light emitting device.

Abstract: A low profile optoelectronic device package has a matalized transparent substrate, a chip and a dam ring. The matalized transparent substrate has a transparent board, a window area, and a metal pattern formed on a face of the transparent board and around the window area and having at least one outer contact pad and at least two contact pads. An active face of the chip is mounted to the at least two inner contact pads and aligned to the window area. A bottom face of the chip, that is opposite to the active face is further added a soldering layer. The dam ring is sealed a joint between the chip and the matalized transparent substrate so as to define an air cavity among the chip, the matalized transparent substrate and the dam ring. The matalized transparent substrate is used as a substrate and an optical cover of a conventional device package, so the optoelectronic device package provides low profile, small area outline, low fabricating cost and high lighting efficiency.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: The embodiments described herein are drawn generally towards illumination assemblies including light emitting devices. In some embodiments, the illumination assemblies including chip-scale packaged light-emitting devices and optical elements.