Abstract: Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.

Abstract: Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.

Abstract: Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.

Abstract: Apparatus (20) for bonding a pair of molds shells (28a, 28b) into a mold includes a first workstation (24) for applying adhesive to one of the shells (28b), and a second workstation (26) having a press (104, 106, 108) for pressing together the shells (28a, 28b) after adhesive has been applied thereto. A base (42) includes a pair of spaced apart base portions (42a, 42b) which are pivotally mounted so as to alternately rotate between the first and second workstations (24, 26). The first workstation (24) includes an adhesive applicator (58) carried on a carriage (88) which is slidably mounted on guiderails (94) so as to shift to a standby position providing access to a mold shell (28b) located on a base portion (42a) so as to allow the shells to be loaded and unloaded at the first workstation (24). A motor driven drip tray (80) is provided on the adhesive applicator (58) to prevent unintended dripping of adhesive onto mold shells or fixtures.