Patents by Inventor Paul Perreault

Paul Perreault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070175023
    Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and a first portion of the bottom surface of the printed circuit board, wherein a second portion of the bottom surface of the printed circuit board is not covered by the tamper wrap is provided. The printed circuit board includes two security trace layers each having two security traces thereon, preferably in a serpentine pattern. The tamper wrap and the security traces together cover and prevent tampering with the electronic circuitry of the printed circuit board.
    Type: Application
    Filed: January 10, 2007
    Publication date: August 2, 2007
    Inventors: Kjell Heitmann, Douglas Clark, Paul Perreault
  • Publication number: 20060021903
    Abstract: A method of attaching a tamper wrap to a printed circuit board using an installation tool that is placed over the main body portion of the tamper wrap. The side tabs of the tamper wrap are folded up against the side walls of the installation tool, and the tamper wrap and the installation tool are inserted into an enclosing case. The installation tool is then removed, the printed circuit board to be wrapped is placed into the enclosing case, and the side tabs are folded and adhered down onto the top surface of the printed circuit board. Also, a printed circuit board assembly having improved heat sinking capabilities including a thermally conductive material located between a printed circuit board and a tamper wrap such that the electronic components are in thermal contact with an enclosing case for enclosing the printed circuit board and the tamper wrap.
    Type: Application
    Filed: September 29, 2005
    Publication date: February 2, 2006
    Inventors: Paul Perreault, Douglas Clark, Kjell Heitmann
  • Publication number: 20050274630
    Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a tamper wrap attached to the printed circuit board. The tamper wrap includes a plurality of side tabs extending from a main body portion and a plurality of corner protection flaps extending from the side tabs. The tamper wrap covers the entirety of a first surface of the printed circuit board and at least a portion of a second surface opposite the first surface of the printed circuit board. Each of the side tabs covers at least a portion of one of the side walls of the printed circuit board and each of the corner flaps is folded around and covers a respective one of the corner edges of the printed circuit board. The printed circuit board may have a plurality of corner sentinels mounted adjacent to the corners of a surface thereof for protecting such corners.
    Type: Application
    Filed: June 15, 2004
    Publication date: December 15, 2005
    Applicant: Pitney Bowes Incorporated
    Inventors: Douglas Clark, Kjell Heitmann, Paul Perreault
  • Publication number: 20050161253
    Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and a first portion of the bottom surface of the printed circuit board, wherein a second portion of the bottom surface of the printed circuit board is not covered by the tamper wrap is provided. The printed circuit board includes two security trace layers each having two security traces thereon, preferably in a serpentine pattern. The tamper wrap and the security traces together cover and prevent tampering with the electronic circuitry of the printed circuit board.
    Type: Application
    Filed: June 15, 2004
    Publication date: July 28, 2005
    Applicant: Pitney Bowes Incorporated
    Inventors: Kjell Heitmann, Douglas Clark, Paul Perreault
  • Publication number: 20050160702
    Abstract: A method of attaching a tamper wrap to a printed circuit board using an installation tool that is placed over the main body portion of the tamper wrap. The side tabs of the tamper wrap are folded up against the side walls of the installation tool, and the tamper wrap and the installation tool are inserted into an enclosing case. The installation tool is then removed, the printed circuit board to be wrapped is placed into the enclosing case, and the side tabs are folded and adhered down onto the top surface of the printed circuit board. Also, a printed circuit board assembly having improved heat sinking capabilities including a thermally conductive material located between a printed circuit board and a tamper wrap such that the electronic components are in thermal contact with an enclosing case for enclosing the printed circuit board and the tamper wrap.
    Type: Application
    Filed: June 15, 2004
    Publication date: July 28, 2005
    Applicant: Pitney Bowes Incorporated
    Inventors: Paul Perreault, Douglas Clark, Kjell Heitmann