Patents by Inventor Paul Phong Nguyen

Paul Phong Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10310351
    Abstract: Embodiments of the invention generally provide electrochromic devices and materials and processes for forming such electrochromic devices and materials. In one embodiment, an electrochromic device contains a lower transparent conductor layer disposed on a substrate, wherein an upper surface of the lower transparent conductor layer has a surface roughness of greater than 50 nm and a primary electrochromic layer having planarizing properties is disposed on the lower transparent conductor layer. The upper surface of the primary electrochromic layer has a surface roughness less than the surface roughness of upper surface of the lower transparent conductor layer, such as about 50 nm or less.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: June 4, 2019
    Assignee: CLEARIST INC.
    Inventor: Paul Phong Nguyen
  • Patent number: 9904137
    Abstract: A precursor solution adapted to provide a metal oxide film, includes: (a) at least one additive selected from a viscosity enhancer, a base, an acid and a wetting agent; (b) structural promoter ions selected from Mn, Ni, Co, Ir, Ru, Cr, Mo, W, Ta, Nb, V, Mo, Zr, V and Ti ions; and (c) at least one solvent. A method for preparing a metal oxide film includes: (a) providing a substrate; and (b) depositing on the substrate the precursor solution of the invention. Metal oxides films, electrochromic devices containing the films and methods for making them are also disclosed.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: February 27, 2018
    Assignee: Clearist, Inc.
    Inventors: Zhongchun Wang, Nelson R. Holcomb, Paul Phong Nguyen
  • Patent number: 8932495
    Abstract: Embodiments of the invention generally provide hydrogen-doped and/or fluorine-doped transparent conducting oxide (TCO) materials and processes for forming such doped TCO materials. In one embodiment, a method for fabricating a doped TCO on a substrate surface includes forming a TCO material on a substrate, exposing the TCO material to a hydrogen plasma while forming a hydrogen-doped TCO material during an atmospheric pressure plasma (APP) process, wherein the hydrogen-doped TCO material contains atomic hydrogen at a concentration within a range from about 1 at % (atomic percent) to about 30 at %, and exposing the hydrogen-doped TCO material to a thermal annealing process. In another embodiment, the method includes exposing the TCO material to a fluorine plasma while forming a fluorine-doped TCO material during the APP process, wherein the fluorine-doped TCO material contains atomic fluorine at a concentration within a range from about 1 at % to about 30 at %.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: January 13, 2015
    Assignee: Clearist, Inc.
    Inventors: Paul Phong Nguyen, Scott Allen Jewhurst
  • Publication number: 20140285866
    Abstract: Embodiments of the invention generally provide electrochromic devices and materials and processes for forming such electrochromic devices and materials. In one embodiment, an electrochromic device contains a lower transparent conductor layer disposed on a substrate, wherein an upper surface of the lower transparent conductor layer has a surface roughness of greater than 50 nm and a primary electrochromic layer having planarizing properties is disposed on the lower transparent conductor layer. The upper surface of the primary electrochromic layer has a surface roughness less than the surface roughness of upper surface of the lower transparent conductor layer, such as about 50 nm or less.
    Type: Application
    Filed: June 3, 2014
    Publication date: September 25, 2014
    Inventor: Paul Phong NGUYEN
  • Patent number: 8780432
    Abstract: Embodiments of the invention generally provide electrochromic devices and materials and processes for forming such electrochromic devices and materials. In one embodiment, an electrochromic device contains a lower transparent conductor layer disposed on a substrate, wherein an upper surface of the lower transparent conductor layer has a surface roughness of greater than 50 nm and a primary electrochromic layer having planarizing properties is disposed on the lower transparent conductor layer. The upper surface of the primary electrochromic layer has a surface roughness less than the surface roughness of upper surface of the lower transparent conductor layer, such as about 50 nm or less.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: July 15, 2014
    Inventor: Paul Phong Nguyen
  • Patent number: 7313858
    Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: January 1, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
  • Patent number: 7304821
    Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: December 4, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
  • Patent number: 7079355
    Abstract: A method for producing a magnetic transducer with an inductive write head having a multilayer coil with a high aspect ratio and a short yoke is disclosed. A damascene process is used for two coil layers and a conventional process for the third coil layer. The process of the invention allows a seed layer for the coil to be deposited on the side walls of the trenches for the first and second coil layers. In one embodiment the seed layer for the coil is preceded by an adhesion layer.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: July 18, 2006
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Richard D. Hsiao, Quang Le, Edward Hin Pong Lee, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Bradley Douglas Webb, Patrick Rush Webb, Samuel Wei-san Yuan
  • Patent number: 6901653
    Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: June 7, 2005
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
  • Patent number: 6876507
    Abstract: A thin-film write head employing pole pieces formed of an electroplated body-centered cubic (BCC) nickel-iron alloy with a saturation flux density (BS) of 1.9 to 2.3 T (19 to 23 kG) and an acceptable coercivity (HC) of about 80 to about 160 A/m (1-2 Oe). The iron content of the electroplated nickel-iron alloy is from 64% to 81% by weight. The two-layer pole fabrication process holds magnetic anisotropy and coercivity to useable values while improving saturation flux density and optimizing magnetostriction. This is accomplished by first electroplating a BCC nickel-iron layer onto an underlying seed layer and then annealing the two layers to reduce coercivity to less than about 160 amps/meter and raise magnetization to acceptable levels.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: April 5, 2005
    Assignee: International Business Machines Corporation
    Inventors: Mike Ming Yu Chen, Thomas Edward Dinan, Paul Phong Nguyen, Neil Leslie Robertson
  • Patent number: 6804879
    Abstract: A method for producing a magnetic transducer with a inductive write head having a multilayer coil with a high aspect ratio and a short yoke is provided. A damascene process is used for two coil layers and a conventional process for the third coil layer. The process of the invention allows a seed layer for the coil to be deposited on the side walls of the trenches for the first and second coil layers. In one embodiment the seed layer for the coil is preceded by an adhesion layer.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: October 19, 2004
    Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
    Inventors: Richard D. Hsiao, Quang Le, Edward Hin Pong Lee, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Bradley Douglas Webb, Patrick Rush Webb, Samuel Wei-san Yuan
  • Publication number: 20040190196
    Abstract: Applicants disclose a method for producing a magnetic transducer with a inductive write head having a multilayer coil with a high aspect ratio and a short yoke. A damascene process is used for two coil layers and a conventional process for the third coil layer. The process of the invention allows a seed layer for the coil to be deposited on the side walls of the trenches for the first and second coil layers. In one embodiment the seed layer for the coil is preceded by an adhesion layer.
    Type: Application
    Filed: March 29, 2004
    Publication date: September 30, 2004
    Inventors: Richard D. Hsiao, Quang Le, Edward Hin Pong Lee, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Bradley Douglas Webb, Patrick Rush Webb, Samuel Wei-san Yuan
  • Publication number: 20040177493
    Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.
    Type: Application
    Filed: March 31, 2004
    Publication date: September 16, 2004
    Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
  • Publication number: 20040080866
    Abstract: Applicants disclose a method for producing a magnetic transducer with a inductive write head having a multilayer coil with a high aspect ratio and a short yoke. A damascene process is used for two coil layers and a conventional process for the third coil layer. The process of the invention allows a seed layer for the coil to be deposited on the side walls of the trenches for the first and second coil layers. In one embodiment the seed layer for the coil is preceded by an adhesion layer.
    Type: Application
    Filed: October 23, 2002
    Publication date: April 29, 2004
    Inventors: Richard D. Hsiao, Quang Le, Edward Hin Pong Lee, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Bradley Douglas Webb, Patrick Rush Webb, Samuel Wei-san Yuan
  • Publication number: 20040075938
    Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.
    Type: Application
    Filed: November 19, 2003
    Publication date: April 22, 2004
    Applicant: HITACHI GLOBAL STORAGE TECHNOLOGIES
    Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
  • Publication number: 20030184912
    Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.
    Type: Application
    Filed: April 2, 2002
    Publication date: October 2, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES
    Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
  • Publication number: 20030137767
    Abstract: A thin-film write head employing pole pieces formed of an electroplated body-centered cubic (BCC) nickel-iron alloy with a saturation flux density (BS) of 1.9 to 2.3 T (19 to 23 kG) and an acceptable coercivity (HC) of about 80 to about 160 A/m (1-2 Oe). The iron content of the electroplated nickel-iron alloy is from 64% to 81% by weight. The two-layer pole fabrication process holds magnetic anisotropy and coercivity to useable values while improving saturation flux density and optimizing magnetostriction. This is accomplished by first electroplating a BCC nickel-iron layer onto an underlying seed layer and then annealing the two layers to reduce coercivity to less than about 160 amps/meter and raise magnetization to acceptable levels.
    Type: Application
    Filed: January 18, 2002
    Publication date: July 24, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mike Ming Yu Chen, Thomas Edward Dinan, Paul Phong Nguyen, Neil Leslie Robertson