Abstract: The present invention relates, generally, to a method and apparatus for electrowinning metals, and more particularly to a method and apparatus for copper electrowinning using the ferrous/ferric anode reaction and a flow-through anode, such as, for example, a dimensionally stable carbon, carbon composite, metal-graphite, or stainless steel anode. In general, the use of a flow-through anode—coupled with an effective electrolyte circulation system—enables the efficient and cost-effective operation of a copper electrowinning system employing the ferrous/ferric anode reaction at a total cell voltage of less than about 1.5 V and at current densities of greater than about 26 Amps per square foot (about 280 A/m2), and reduces acid mist generation. Furthermore, the use of such a system permits the use of low ferrous iron concentrations and optimized electrolyte flow rates as compared to prior art systems while producing high quality, commercially saleable product (i.e.

Abstract: A Fiber Optic Plate is the substrate or part of the substrate in a multichip module. Multichip modules can be stacked to form layers of densely packed integrated circuit die. Optical signals carry data from one layer in the stack to one or more of the other multichip module layers or to peripheral devices physically separate from the stack. Data are transmitted at much greater speed by such optical signals than by traditional electronic interconnects. The Fiber Optic Plate guides the optical signals, minimizing signal crosstalk and allowing for many optical signals to occupy a small area on the module. A Fiber Optic Plate as all or part of the multichip module also provides a means to accurately align the individual modules in a stack.