Abstract: In this method of fabricating an electrical circuit assembly, a thick film hybrid substrate is held in an inverted position as apertured glass-ceramic beads are placed over the end leads on the substrate. A drop of liquid flux is then applied to the apertures to hold the beads in place. After the flux dries, the leads are inserted into plated-through holes in a circuit board, with the beads locating portions of the leads above the board. Following wave soldering of the board, the beads are fractured with a sharp instrument prior to a cleaning operation which removes bead parts from the soldered assembly. In this manner, the substrate is flexibly mounted in the board so that the substrate can be tilted without damaging it.

Abstract: An improved edge clip terminal having a first diamond-shaped transition region connecting a plurality of tines, that clip over the edge of a substrate, to a first lead section and having a second diamond-shaped transition region connecting the first lead section to a second lead section. In an assembly, the second lead sections of a plurality of terminals are located in holes in a PC board with the second transition regions resting on the surface of the circuit board. The first lead sections are more narrow than the transition regions and of lengths that are sufficient for preventing solder wicking up them and into the areas of the tines during wave soldering of a circuit board so that a leaded substrate soldered into the circuit board may be tilted without damaging it. In an alternate embodiment of this invention, the lead portion of an edge clip terminal on a substrate has a pair of spaced apart transition regions in it.