Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: A system for generating a three-dimensional height image of a reflective target includes an illumination source configured to generate a patterned illumination on the reflective target, and an imaging system configured to acquire an image of the patterned illumination on the reflective target, the illumination source and camera being aligned relative to the target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source and the camera configured to generate a first height image of the target based on the acquired image, the first height image being used by the controller to determine a position, a height, and a tilt of the target and calculate an error function based on the determination to compensate the first height image for the calculated error.

Abstract: A system for generating a three-dimensional height image of a reflective test target includes an illumination source configured to generate a patterned illumination on the test target, an imaging system configured to acquire an image of the patterned illumination on the test target, and a variable focus optical system configured to cause the camera to image the test target with at least two distinct focus positions, the illumination source and camera being aligned relative to the test target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source, the camera and the variable focus optical system, the controller being configured to generate a height image of the test target based on the acquired image of the patterned illumination using at least two distinct focal positions.

Abstract: An optical phase profilometry system includes a first operative coaxial camera-projector pair aligned at a first angle relative to a target surface that projects a first illumination on the target surface and a second operative coaxial camera-projector pair aligned at a second angle relative to the target surface that projects a second illumination on the target surface. Wherein the first and second angles are equal and opposite to one another relative to the target surface such that the second operative coaxial camera-projector pair is configured to capture a first reflection from the first illumination and the first operative coaxial camera-projector pair is configured to capture a second reflection from the second illumination. The optical phase profilometry system further includes a controller configured to, based on the captured first and second reflections, generate a first and second estimation of the target surface and combine them to generate a dimensional profile of the target surface.

Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: An optical phase profilometry system includes a first operative coaxial camera-projector pair aligned at a first angle relative to a target surface that projects a first illumination on the target surface and a second operative coaxial camera-projector pair aligned at a second angle relative to the target surface that projects a second illumination on the target surface. Wherein the first and second angles are equal and opposite to one another relative to the target surface such that the second operative coaxial camera-projector pair is configured to capture a first reflection from the first illumination and the first operative coaxial camera-projector pair is configured to capture a second reflection from the second illumination. The optical phase profilometry system further includes a controller configured to, based on the captured first and second reflections, generate a first and second estimation of the target surface and combine them to generate a dimensional profile of the target surface.

Abstract: A system for generating a three-dimensional height image of a reflective test target includes an illumination source configured to generate a patterned illumination on the test target, an imaging system configured to acquire an image of the patterned illumination on the test target, and a variable focus optical system configured to cause the camera to image the test target with at least two distinct focus positions, the illumination source and camera being aligned relative to the test target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source, the camera and the variable focus optical system, the controller being configured to generate a height image of the test target based on the acquired image of the patterned illumination using at least two distinct focal positions.

Abstract: A system for generating a three-dimensional height image of a reflective target includes an illumination source configured to generate a patterned illumination on the reflective target, and an imaging system configured to acquire an image of the patterned illumination on the reflective target, the illumination source and camera being aligned relative to the target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source and the camera configured to generate a first height image of the target based on the acquired image, the first height image being used by the controller to determine a position, a height, and a tilt of the target and calculate an error function based on the determination to compensate the first height image for the calculated error.

Abstract: A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source generates patterned illumination from a first point of view. At least one camera acquires an image of the patterned illumination from a second point of view. A controller is coupled to the source, and to the at least one camera. The controller generates a height topology of the circuit board based on images acquired from first and second image detectors of the patterned illumination. The characteristics of the pattern illumination are modified based on knowledge of the circuit board to enhance the dynamic range of the sensor and to reject image defects caused by multipath reflections.

Abstract: A system for generating a program used to direct the operation of a solder paste inspection machine is provided. The system includes a solder paste inspection system having a stencil mounting bracket located therein and configured to hold a solder paste printing stencil in position within an inspection region of the solder paste inspection system. An image sensor is mounted in the solder paste inspection system and is configured to acquire images of a stencil mounted on the stencil mounting bracket. A controller is coupled to the image sensor and is configured to generate a solder paste inspection program using the acquired images of the stencil.

Abstract: A system for generating a program used to direct the operation of a solder paste inspection machine is provided. The system includes a solder paste inspection system having a stencil mounting bracket located therein and configured to hold a solder paste printing stencil in position within an inspection region of the solder paste inspection system. An image sensor is mounted in the solder paste inspection system and is configured to acquire images of a stencil mounted on the stencil mounting bracket. A controller is coupled to the image sensor and is configured to generate a solder paste inspection program using the acquired images of the stencil.

Abstract: A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source generates patterned illumination from a first point of view. At least one camera acquires an image of the patterned illumination from a second point of view. A controller is coupled to the source, and to the at least one camera. The controller generates a height topology of the circuit board based on images acquired from first and second image detectors of the patterned illumination. The characteristics of the pattern illumination are modified based on knowledge of the circuit board to enhance the dynamic range of the sensor and to reject image defects caused by multipath reflections.

Abstract: A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source projects an illumination pattern from a first angle of incidence. A first camera acquires an image of the structured light pattern on the circuit board from a second angle of incidence. A second camera simultaneously acquires an image of the structured light pattern on the circuit board from a third angle of incidence, the third angle of incidence differing from the second angle of incidence. A controller is coupled to the illumination source and to the at least two camera devices. The controller generates a height topology of the circuit board based on images acquired from the at least two camera devices of the structure light illuminator.

Abstract: An optical inspection system and method are provided. A workpiece transport moves a workpiece in a nonstop manner. An illuminator includes a light pipe and is configured to provide a first and second strobed illumination field types. First and second arrays of cameras are arranged to provide stereoscopic imaging of the workpiece. The first array of cameras is configured to generate a first plurality of images of the workpiece with the first illumination field and a second plurality of images of the feature with the second illumination field. The second array of cameras is configured to generate a third plurality of images of the workpiece with the first illumination field and a fourth plurality of images of the feature with the second illumination field. A processing device stores at least some of the first, second, third, and fourth pluralities of images and provides the images to an other device.

Abstract: A system for sensing a three-dimensional topology of a test surface is provided. A first illumination source generates first patterned illumination from a first point of view. A second illumination source generates second patterned illumination from a second point of view, the second point of view differing from the first point of view. An area array image detector simultaneously acquires at least first and second fringe images relative to the first and second patterned illuminations. A controller is coupled to the first and second sources and to the detector. The controller generates a height topology of the test surface based on images acquired while the first and second patterned illuminators are energized.

Abstract: A method for mapping height of a feature upon a test surface is provided. The method includes projecting patterned illumination upon the feature, the patterned illumination having a plurality of distinct fringe periods. A first image of the feature is acquired while the patterned illumination is projected upon the feature. Relative movement is then generated between a sensor and the feature to cause relative displacement of a fraction of a field of view of a detector, the fraction being equal to about an inverse of the number of distinct regions of a reticle generating the pattern. Then, a second image of the feature is acquired while the patterned illumination is projected upon the feature. The height map is generated based, at least, upon the first and second images.

Abstract: An optical inspection system and method are provided. A workpiece transport moves a workpiece in a nonstop manner. An illuminator includes a light pipe and is configured to provide a first and second strobed illumination field types. First and second arrays of cameras are arranged to provide stereoscopic imaging of the workpiece. The first array of cameras is configured to generate a first plurality of images of the workpiece with the first illumination field and a second plurality of images of the feature with the second illumination field. The second array of cameras is configured to generate a third plurality of images of the workpiece with the first illumination field and a fourth plurality of images of the feature with the second illumination field. A processing device stores at least some of the first, second, third, and fourth pluralities of images and provides the images to an other device.

Abstract: Embodiments include measuring motion characteristics of the workpiece through the placement process. Since the component is placed on the workpiece with some force to ensure proper adhesion to the workpiece, some deflection of the workpiece is expected during the placement cycle. The placement force is adjusted to ensure that the component is safely placed into the solder paste or adhesive. Placement force is adjusted through a number of characteristics including: choice of spring tension in the nozzle; the length of the nozzle and the amount of over-travel into the board; the rigidity of the board and design; and the placement of the board support mechanisms. With proper adjustment of these characteristics and parameters, high quality placements onto the workpiece can be ensured.