Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.

Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.

Abstract: A leadframe for use with integrated circuit chips comprising a plated layer of gold selectively covering areas of said leadframe intended for solder attachment; and said gold layer providing a visual distinction to said areas.

Abstract: The invention is a leadframe/stabilizer (35) for use with semiconductor devices. Stabilizer (35) is for stabilizing the space between of lead frame leads (36–39) and improving the lead to lead spacing and to improve lead tip planarity. Stabilizer (35) extends partially along the length of and on each side of said lead frame leads (36–39) and include a die pad mount (40), integral with and forming a part of said stabilizer 35.

Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.

Abstract: For a leadframe for use with integrated circuit chips, a continuous strip of sheet-like base metal is pre-plated with a layer of nickel fully covering the base metal, further on one surface with a palladium layer in a thickness suitable for bonding wire attachment, and on the opposite surface with a layer of either palladium or lead-free solder in a thickness suitable for parts attachment. The leadframe structure is then stamped from the sheet so that the base metal is exposed at the stamped edges, enhancing adhesion to molding compounds.

Abstract: An enhanced gradient dragout system conserves plating chemicals, including precious metals by providing a series of tanks with cascading rinse solutions having a flow rate controlled by heating the first tank to increase the evaporation rate. A portion of the concentrated solution in the heated tank is returned to the process tank. The system minimizes the requirements for clean rinse water, and the need for emptying contaminated rinse tanks with associated recovery and disposal environmental and cost issues. The low cost system is flexible and the process is adapted to the material and process requirements of the plating line.

Abstract: A leadframe for use with integrated circuit chips comprising a plated layer of gold selectively covering areas of said leadframe intended for solder attachment; and said gold layer providing a visual distinction to said areas.

Abstract: A leadframe for use with integrated circuit chips comprising a plated layer of gold selectively covering areas of said leadframe intended for solder attachment; and said gold layer providing a visual distinction to said areas.

Abstract: An enhanced gradient dragout system conserves plating chemicals, including precious metals by providing a series of tanks with cascading rinse solutions having a flow rate controlled by heating the first tank to increase the evaporation rate. A portion of the concentrated solution in the heated tank is returned to the process tank. The system minimizes the requirements for clean rinse water, and the need for emptying contaminated rinse tanks with associated recovery and disposal environmental and cost issues. The low cost system is flexible and the process is adapted to the material and process requirements of the plating line.

Abstract: An enhanced gradient dragout system conserves plating chemicals, including precious metals by providing a series of tanks with cascading rinse solutions having a flow rate controlled by heating the first tank to increase the evaporation rate. A portion of the concentrated solution in the heated tank is returned to the process tank. The system minimizes the requirements for clean rinse water, and the need for emptying contaminated rinse tanks with associated recovery and disposal environmental and cost issues. The low cost system is flexible and the process is adapted to the material and process requirements of the plating line.

Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.

Abstract: For a leadframe for use with integrated circuit chips, a continuous strip of sheet-like base metal is pre-plated with a layer of nickel fully covering the base metal, further on one surface with a palladium layer in a thickness suitable for bonding wire attachment, and on the opposite surface with a layer of either palladium or lead-free solder in a thickness suitable for parts attachment. The leadframe structure is then stamped from the sheet so that the base metal is exposed at the stamped edges, enhancing adhesion to molding compounds.

Abstract: The invention is a method for making a lead frame (30) having fine pitched lead frame leads (32). A first side of the lead frame material is etched to for the lead frame and define the lead frame leads and die pad, but the etch process does not etch completely through the lead frame material. The partially etched first side is then covered with a tape (31) or layer of photoresist (71). The second side of the lead fame material is then etched to complete the lead frame. The lead frame may then be plated.

Abstract: A leadframe having the desirable features of palladium plated leadframes, such as compatibility with both wire bonding and solder reflow, as well as good adhesion to molding compounds is provided by plating the interior lead frame portions with one microinch of palladium and the external leads which contact solder with three microinches of palladium. A low cost method for fabricating the leadframe based on a unique combination of proven processes is provided.

Abstract: A method and system for electroplating a metal coating onto a continuous part, such as the leadframe stock used in packaging integrated circuits, whereby the method comprises plating metal from a series of plating baths having the same or compatible chemical composition, supplying a continuous electrical connection between the D.C. power supply via a rotating contact held in intimate contact with the cathode, and cooling the contact by using the plating solution itself.

Abstract: A method and circuit (14) for monitoring an electroplating operation of an electroplating machine (10) of the type having a first electroplating cell (18) for depositing nickel onto an integrated circuit leadframe (12) and a second electroplating cell (19) for subsequently depositing palladium onto the leadframe (12). A first current (30) is applied in the first electroplating cell (18) to form a nickel deposit on the leadframe (12) and a second current (31) is applied in the second electroplating cell (19) to from a palladium deposit on the nickel deposit. The second current (31) is greater than the first current (30) if the electroplating machine (10) is operating normally. The first current (30) and second current (31) are compared in a comparator (44) during the electroplating operation, and if the second current (31) is less than the first current (30), an error signal is generated on an output line (50). If desired, the electroplating machine (10) may be stopped in response to the error signal.

Abstract: A method and circuit (14) for monitoring an electroplating operation of an electroplating machine (10) of the type having a first electroplating cell (18) for depositing nickel onto an integrated circuit leadframe (12) and a second electroplating cell (19) for subsequently depositing palladium onto the leadframe (12). A first current (30) is applied in the first electroplating cell (18) to form a nickel deposit on the leadframe (12) and a second current (31) is applied in the second electroplating cell (19) to from a palladium deposit on the nickel deposit. The second current (31) is greater than the first current (30) if the electroplating machine (10) is operating normally. The first current (30) and second current (31) are compared in a comparator (44) during the electroplating operation, and if the second current (31) is less than the first current (30), an error signal is generated on an output line (50). If desired, the electroplating machine (10) may be stopped in response to the error signal.

Abstract: An enclosed plating wheel system includes a fixed mounted shaft, feed and return spargers mounted on the shaft, and a plating wheel rotates around the fixed mounted spargers as a result of a lead frame strip being pulled around the plating wheel. A belt is also rotated around a portion of the plating wheel assembly over the lead frame strip to contain the plating solution within the plating wheel assembly.