Patents by Inventor Paul R. Sharratt

Paul R. Sharratt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure for temporarily isolating a die from a common conductor to facilitate wafer level testing
    Patent number: 6819161
    Abstract: The invention provides an apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: November 16, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Phillip E. Byrd, Paul R. Sharratt
  • Structure for temporarily isolating a die from a common conductor to facilitate wafer level testing
    Patent number: 6809378
    Abstract: The invention provides an apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: October 26, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Phillip E. Byrd, Paul R. Sharratt
  • Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing
    Publication number: 20040051098
    Abstract: The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.
    Type: Application
    Filed: August 28, 2003
    Publication date: March 18, 2004
    Inventors: Phillip E. Byrd, Paul R. Sharratt
  • Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing
    Publication number: 20030045013
    Abstract: The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.
    Type: Application
    Filed: October 11, 2002
    Publication date: March 6, 2003
    Inventors: Phillip E. Byrd, Paul R. Sharratt