Abstract: A pin grid array package is disclosed for an integrated circuit chip having a preformed main body member of a first synthetic organic polymer with a central cavity in which the integrated circuit chip is mounted, a metallized layer of a second synthetic organic polymer being bonded to said preformed main body member for electrical interconnection to the chip, and with terminal pins protruding from said preformed main body member as a means to further electrically interconnect the chip to exterior electrical terminals. A method to form said main body member is also disclosed using a thermoplastic polymer wherein the terminal pins along with a recessed base element provided in said body member for improved thermal conductivity are included when said main body member is first molded. A further method whereby the integrated circuit chip is assembled in said plastic carrier package is also disclosed.

Abstract: A heat spreader which is self-positioning into a mold cavity prior to encapsulation in plastic is provided. To minimize capacitance between the spreader and a metal lead frame having a semiconductor die mounted thereon, the heat spreader has a frame with notches in the opposite ends which define bifurcated limbs. Lateral standoffs extend from each of the sides thereof and feet extend from the bottom surface thereof. A central portion extends a predetermined distance from the top surface thereof for intimate positioning with the lead frame. The standoffs, limbs and feet are sized to firmly position the heat spreader upon insertion into the mold cavity. To maintain substantially constant capacitance between the spreader and the lead frame from part to part, each bifurcated limb has an inner edge which complements or conforms to the portion of the lead frame which will overlay the limb in the encapsulated plastic.