Abstract: Embodiments of the present disclosure relate to automatically and dynamically elevating permissions on a mainframe system. Initially, a user may request an elevation class which corresponds to elevated class resources of the mainframe system. The elevation class may enable the user to perform actions to datasets, files, applications, or systems of the mainframe system the user may not otherwise be able to perform. If the user has permission to the elevation class, a user identification corresponding to the user and the elevation class is registered in an elevated permission structure. An access control environment element (ACEE) is dynamically created with the elevated permission structure and the elevated class resources of the elevation class are associated with the ACEE. The user can then be validated with access to the elevated class resources. At the expiration of a limited duration of time, the elevated class resources are automatically disassociated with the ACEE.

Abstract: Embodiments of the present disclosure relate to automatically and dynamically elevating permissions on a mainframe system. Initially, a user may request an elevation class which corresponds to elevated class resources of the mainframe system. The elevation class may enable the user to perform actions to datasets, files, applications, or systems of the mainframe system the user may not otherwise be able to perform. If the user has permission to the elevation class, a user identification corresponding to the user and the elevation class is registered in an elevated permission structure. An access control environment element (ACEE) is dynamically created with the elevated permission structure and the elevated class resources of the elevation class are associated with the ACEE. The user can then be validated with access to the elevated class resources. At the expiration of a limited duration of time, the elevated class resources are automatically disassociated with the ACEE.

Abstract: An inkjet nozzle device includes: a nozzle chamber having a floor, a roof and perimeter sidewalls extending between the floor and the roof, wherein a nozzle aperture is defined in the roof; a heating element for generating gas bubbles in the nozzle chamber so as to eject ink through the nozzle aperture, wherein a centroid of the heating element is aligned with a centroid of the nozzle aperture; and a pair of chamber inlets defined in the floor of the nozzle chamber, the chamber inlets being symmetrically disposed about the centroid of the heating element. The inkjet nozzle device has a pair of orthogonal symmetry planes passing through the centroid of the nozzle aperture.

Abstract: An inkjet nozzle device includes: a nozzle chamber having a floor, a roof and perimeter sidewalls extending between the floor and the roof, wherein a nozzle aperture is defined in the roof; a heating element for generating gas bubbles in the nozzle chamber so as to eject ink through the nozzle aperture, wherein a centroid of the heating element is aligned with a centroid of the nozzle aperture; and a pair of chamber inlets defined in the floor of the nozzle chamber, the chamber inlets being symmetrically disposed about the centroid of the heating element. The inkjet nozzle device has a pair of orthogonal symmetry planes passing through the centroid of the nozzle aperture.

Abstract: A method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold is provided. The method comprises the steps of: (a) providing an adhesive polymeric film having a protective liner; (b) depositing photoresist onto the protective liner; (c) photopatterning the photoresist to define a plurality of openings positioned for etching supply holes through the film; (d) etching the plurality of ink supply holes through the film, the photoresist acting as a mask for the etch; and (e) removing the protective liner having the photoresist deposited thereon.

Abstract: A thermal inkjet printhead with generally planar heater elements disposed in respective bubble forming chambers such that they are bonded on one side to the chamber so that the other side faces into the chamber. Each heater element receives an energizing pulse to heat ejectable liquid above its boiling point to form a gas bubble on the side facing into the chamber, whereby the gas bubble causes the ejection of a drop of the ejectable liquid from the nozzle. The chamber has a dielectric layer proximate the side of the heater element bonded to the chamber. The dielectric layer has a thermal product less than 1495 Jm?2K?1s?1/2, the thermal product being (?Ck)1/2, where ? is the density of the layer, C is specific heat of the layer and k is thermal conductivity of the layer. The present invention reduces the drop ejection energy and the heat dissipation into the printhead IC by improving the thermal isolation between the heater and the substrate.