Patents by Inventor Paul Richard Proctor

Paul Richard Proctor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical-mechanical polisher hardware design
    Patent number: 7052372
    Abstract: A polish apparatus for planarizing wafers and films over wafers comprising the following. A substrate chuck for holding a substrate with a surface to be polished thereof being directed about vertically. A first drive means for rotating the substrate chuck. A polishing head having a polishing surface which is adjacent to the substrate during the polishing of the substrate. The polishing surface of the polishing head is smaller than the surface of the substrate. A polishing solution supply means for supplying a polishing solution through the polishing head to the substrate held by the substrate chuck. A reciprocating means for reciprocally moving the polishing head on the surface to be polished. A pressing means for pressing the polishing pad against a substrate held by the substrate chuck by way of the polishing head. The polish head is preferably comprised of one piece of molded polymer. No polish pad is used.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: May 30, 2006
    Assignee: Chartered Semiconductor Manufacturing, LTD
    Inventors: Seng-Keong Victor Lim, Paul Richard Proctor, Robert Chin Fu Tsai
  • Chemical-mechanical polisher hardware design
    Publication number: 20030114086
    Abstract: A polish apparatus for planarizing wafers and films over wafers comprising the following. A substrate chuck for holding a substrate with a surface to be polished thereof being directed about vertically. A first drive means for rotating the substrate chuck. A polishing head having a polishing surface which is adjacent to the substrate during the polishing of the substrate. The polishing surface of the polishing head is smaller than the surface of the substrate. A polishing solution supply means for supplying a polishing solution through the polishing head to the substrate held by the substrate chuck. A reciprocating means for reciprocally moving the polishing head on the surface to be polished. A pressing means for pressing the polishing pad against a substrate held by the substrate chuck by way of the polishing head. The polish head is preferably comprised of one piece of molded polymer. No polish pad is used.
    Type: Application
    Filed: December 13, 2001
    Publication date: June 19, 2003
    Inventors: Seng-Keong Victor Lim, Paul Richard Proctor, Robert Chin Fu Tsai