Abstract: A metal-core printed circuit board (MCPCB) and method of generating an ultra-narrow, high-current pulse driver with a MCPCB is provided. The MCPCB includes a rigid, metal heat sink layer and at least one electrically conductive top layer. At least one electrically insulating dielectric layer is positioned between the conductive top layer and rigid, metal heat sink layer, wherein the dielectric layer has a thickness of less than 0.007 inches.

Abstract: A compact connector that mates with a complementary connector at high mating force. The connector (100) may have a housing (102) with a member (104) having a plurality of sides (106) and an opening (108) at a first side (110), and a frame (114) mounted to the member (104) from the first side (110) and having a plurality of walls (116) so as to bound the opening (108). The frame (114) may be made of a material that withstands forces to which the connector (100) may be exposed during mating. The member (104) may be made of a less robust material, such as plastic with thin walls (116) so as to enable a compact connector. The frame (114) and the member (104) may have engagement features, including latches, complementary chamfer and bevel features that may aid in mounting the frame (114) to the member (104) and locking features that resist dis-engagement of the frame (114) and the member (104).

Abstract: A compact connector that mates with a complementary connector at high mating force. The connector (100) may have a housing (102) with a member (104) having a plurality of sides (106) and an opening (108) at a first side (110), and a frame (114) mounted to the member (104) from the first side (110) and having a plurality of walls (116) so as to bound the opening (108). The frame (114) may be made of a material that withstands forces to which the connector (100) may be exposed during mating. The member (104) may be made of a less robust material, such as plastic with thin walls (116) so as to enable a compact connector. The frame (114) and the member (104) may have engagement features, including latches, complementary chamfer and bevel features that may aid in mounting the frame (114) to the member (104) and locking features that resist dis-engagement of the frame (114) and the member (104).

Abstract: A metal-core printed circuit board (MCPCB) and method of generating an ultra-narrow, high-current pulse driver with a MCPCB is provided. The MCPCB includes a rigid, metal heat sink layer and at least one electrically conductive top layer. At least one electrically insulating dielectric layer is positioned between the conductive top layer and rigid, metal heat sink layer, wherein the dielectric layer has a thickness of less than 0.007 inches.

Abstract: A card edge connector with latching that enables a compact connector. The connector includes a latch, centrally located along the connector. The latch may be aligned with an alignment rib of the connector housing, reducing the space required for the latch. In some embodiments, portions of the latch may be bifurcated so that the latch may straddle the rib. In this way, space for a latch in a circuit assembly using the connector may be less than in conventional connector with latches on each end.

Abstract: A card edge connector with latching that enables a compact connector. The connector includes a latch, centrally located along the connector. The latch may be aligned with an alignment rib of the connector housing, reducing the space required for the latch. In some embodiments, portions of the latch may be bifurcated so that the latch may straddle the rib. In this way, space for a latch in a circuit assembly using the connector may be less than in conventional connector with latches on each end.

Abstract: An airflow damper is provided, the airflow damper includes a resilient body having a fixed end and a free end. In a default state, the free end extends to restrict airflow. In a device accommodation state, the free end flattens to accommodate a device.

Abstract: An airflow damper Is provided, the airflow damper includes a resilient body having a fixed end and a free end. In a default state, the free end extends to restrict airflow. In a device accommodation state, the free end flattens to accommodate a device.

Abstract: A wireless signal processor for use in identifying a maximum Carrier to Noise Interference Ratio (CINR) associated with a plurality of received OFDMA subcarriers has a candidate generator for forming a plurality of candidate values from a particular set of received subcarriers by forming candidate values based on the received subcarriers in combination with possible integer preamble offsets and possible preamble values. A candidate evaluator selects which of the possible preamble values and integer frequency offset values have the maximum CINR, and provides the maximum CINR with IFO and preamble index as outputs.

Abstract: The present invention relates to a wide-angle view binocular device to enable persons sitting in an area requiring wide viewing angles, such as in a movie theater or in a sports arena, to see images at the peripheral edges as clearly as those images viewed straight ahead, with minimal barrel distortion of the viewer's field of view.

Abstract: A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.

Abstract: A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.

Abstract: A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface of the PC board and concentrically spaced from the PC board within the opening. An air gap occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.

Abstract: A method and apparatus for noninvasively determining hematocrit utilizing the frequency-dependent electrical impedance characteristics of whole blood by electrically stimulating a patient body portion containing a vascular compartment with a current source over a range of frequencies. A hematocrit measurement system includes a signal generator and demodulator (SGD) that sends an applied signal to an electrode pod that applies a current to a limb of a patient. The electrode pod receives resulting measured voltage signals and provides them to the SGD. The SGD provides to a personal computer (PC) signals indicative of the current passing through the limb of a patient and the resulting voltage. The voltage and current may be measured for various frequencies over, for example, a range from about 10 kHz to about 10 MHz. The electrical impedance from the blood alone is isolated from the total limb impedance from the blood, tissue, bone, etc.