Abstract: A particle isolation system includes a semiconductor process chamber; at least one member within the semiconductor process chamber wherein the member has at least a first position and a second position; and at least one isolation compartment having a plurality of walls, the isolation compartment defined by the plurality of walls, at least one of the plurality of walls of the isolation compartment defining at least one opening wherein the member in the first position permits particles to enter the isolation compartment from the semiconductor process chamber through the opening, and wherein the member in the second position substantially encloses the isolation compartment thereby substantially retaining the particles in the isolation compartment and substantially limiting movement of the particles between the semiconductor process chamber and the isolation compartment through the opening. An ion implant system is also provided.

Abstract: A particle isolation system includes a semiconductor process chamber; at least one member within the semiconductor process chamber wherein the member has at least a first position and a second position; and at least one isolation compartment having a plurality of walls, the isolation compartment defined by the plurality of walls, at least one of the plurality of walls of the isolation compartment defining at least one opening wherein the member in the first position permits particles to enter the isolation compartment from the semiconductor process chamber through the opening, and wherein the member in the second position substantially encloses the isolation compartment thereby substantially retaining the particles in the isolation compartment and substantially limiting movement of the particles between the semiconductor process chamber and the isolation compartment through the opening. An ion implant system is also provided.

Abstract: This disclosure provides an approach for cleaning an ion implanter. In this disclosure, there is a vacuum device having an in-take port adapted to receive a contaminant removing hose. The vacuum device and hose are configured to provide constant suction to the ion implanter. A dry ice blaster having a dry ice dispensing hose is configured to supply dry ice. A sealing plate is adapted to attach to an access section of a processing region of the ion implanter. The sealing plate has a first opening configured to receive the contaminant removing hose and the dry ice dispensing hose.

Abstract: A particle isolation system includes a semiconductor process chamber; at least one member within the semiconductor process chamber wherein the member has at least a first position and a second position; and at least one isolation compartment having a plurality of walls, the isolation compartment defined by the plurality of walls, at least one of the plurality of walls of the isolation compartment defining at least one opening wherein the member in the first position permits particles to enter the isolation compartment from the semiconductor process chamber through the opening, and wherein the member in the second position substantially encloses the isolation compartment thereby substantially retaining the particles in the isolation compartment and substantially limiting movement of the particles between the semiconductor process chamber and the isolation compartment through the opening. An ion implant system is also provided.

Abstract: This disclosure provides an approach for cleaning an ion implanter. In this disclosure, there is a vacuum device having an in-take port adapted to receive a contaminant removing hose. The vacuum device and hose are configured to provide constant suction to the ion implanter. A dry ice blaster having a dry ice dispensing hose is configured to supply dry ice. A sealing plate is adapted to attach to an access section of a processing region of the ion implanter. The sealing plate has a first opening configured to receive the contaminant removing hose and the dry ice dispensing hose.

Abstract: An ion implanter system, method and program product for detecting at least one particle level in an beam and controlling the ion beam based on the at least one particle level during any stage of operation including ion implantation. A bright-field laser particle detector is employed that transmits and receives the laser beam directly through at least a portion of the ion beam to obtain an accurate particle level. The invention allows for observance of ion beam-borne particles and correction of the ion beam by a system controller in real-time to minimize particle level(s). During ion implantation, processing may be stopped until particle level(s) are below a preset value. The invention allows particle level detection during implantation such that post implant steps to check wafer particle levels are unnecessary.