Abstract: A manufacturing method of a continuous transparent polyimide film for a display includes the following steps providing a roll-to-roll polyimide film; providing a polyimide precursor, which is coated on the polyimide film; and baking the polyimide precursor at a baking temperature that is at least 20° C. higher than a glass transition temperature of the transparent polyimide film, such that the transparent polyimide film has an optical transmittance of greater than 85%, a chromaticity (b*) of less than 2, and a standard deviation of three axial refractive indices of the transparent polyimide film is less than 0.0012. Thus, the transparent polyimide film with reduced light leakage can be obtained.

Abstract: A peelable polyimide composite film includes a first polyimide film having a first surface and a second surface opposite to each other; and a second polyimide film attached to the first surface of the first polyimide film A difference in coefficient of thermal expansion between the first polyimide film and the second polyimide film is greater than or equal to 9 um/m° C., so that the first polyimide film and the second polyimide film can be peeled off from each other.

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

Abstract: A multilayer polyimide-containing film comprises a coloring layer containing a pigment, and a first protection layer disposed on one surface of the coloring layer, the first protection layer having a thickness between about 0.5 and about 3 micrometers. In some embodiments, methods of manufacturing the multilayer polyimide-containing film are also described.

Abstract: This invention relates to a multi-layer polyimide film and a method of manufacturing the same. The multi-layer polyimide film may include a functional filler. The multi-layer polyimide film is manufactured according to the method of this invention.

Abstract: A polyimide resin having good thermal stability and good adhesion to a metal foil is disclosed. The polyimide resin is prepared by dissolving at least one diamine in a polar aprotic solvent followed by the addition of an aromatic tetracarboxylic acid dianhydride to the solution of the aromatic diamines to prepare a polyamic acid solution, imidizing this solution to a polyimide resin by heating at a temperature above 250.degree. C., the polar aprotic solvent comprising at least 1 weight % of acetone. Polyimide laminates with a metal foil, such as a copper foil, are also described. The laminates may be used to form flexible printed circuit boards.