Patents by Inventor Paul S. Martin

Paul S. Martin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220108363
    Abstract: A system and method of model-based estimating comprising: receiving a master estimate, including a plurality of master subitem estimates; generating a model estimate, including a plurality of model subitem estimates; generating a subjectives estimate, including a plurality of subjectives subitem estimates; receiving a model update; determining which of said model subitem estimates and said subjectives subitem estimates is impacted by said model update; determining one or more cost updates to said model subitem estimates and said subjectives subitem estimates; updating at least one of said model subitem estimates and said subjectives subitem estimate, based at least in part upon said step of determining one or more cost updates to said model subitem estimates and said subjectives subitem estimates.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 7, 2022
    Inventors: Hung Viet Nguyen, Paul S. Martin
  • Publication number: 20210345536
    Abstract: An agricultural assembly that includes an autonomous or semi-autonomous agricultural vehicle, an agricultural implement connected to the agricultural vehicle, and a plug detection system. The plug detection system includes at least one sensor connected to the agricultural implement for sensing an operational variable and a controller operably connected to the at least one sensor. The controller is configured for detecting a plugged state of the agricultural implement, in which matter hinders operation of the agricultural implement, dependent upon the operational variable of the agricultural implement.
    Type: Application
    Filed: May 7, 2021
    Publication date: November 11, 2021
    Applicant: CNH Industrial America LLC
    Inventors: Seth M. Bich, Robin Michael Pritz, Paul S. Martin
  • Patent number: 10074772
    Abstract: The surface of a light emitting device is roughened to enhance the light extraction efficiency of the surface, but the amount of roughened area is selected to achieve a desired level of light extraction efficiency. Photo-lithographic techniques may be used to create a mask that limits the roughening to select areas of the light emitting surface. Because the amount of roughened area can be precisely controlled, the light extraction efficiency can be precisely controlled, substantially independent of the particular process used to roughen the surface. Additionally, the selective roughening of the surface may be used to achieve a desired light emission output pattern.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: September 11, 2018
    Assignee: Lumileds LLC
    Inventors: Maciej Benedict, Paul S. Martin, Boris Kharas
  • Patent number: 9960319
    Abstract: The surface of a light emitting device is roughened to enhance the light extraction efficiency of the surface, but the amount of roughened area is selected to achieve a desired level of light extraction efficiency. Photo-lithographic techniques may be used to create a mask that limits the roughening to select areas of the light emitting surface. Because the amount of roughened area can be precisely controlled, the light extraction efficiency can be precisely controlled, substantially independent of the particular process used to roughen the surface. Additionally, the selective roughening of the surface may be used to achieve a desired light emission output pattern.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: May 1, 2018
    Assignee: Lumileds LLC
    Inventors: Maciej Benedict, Paul S. Martin, Boris Kharas
  • Patent number: 9081167
    Abstract: One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: July 14, 2015
    Assignees: Koninklijke Philips N.V., Philips Lumileds Lighting Company LLC
    Inventors: Grigoriy Basin, Robert Scott West, Paul S. Martin, Gerard Harbers, Willem H. Smits, Robert F. M. Hendriks, Frans H. Konijn
  • Publication number: 20140327030
    Abstract: The surface of a light emitting device is roughened to enhance the light extraction efficiency of the surface, but the amount of roughened area is selected to achieve a desired level of light extraction efficiency. Photo-lithographic techniques may be used to create a mask that limits the roughening to select areas of the light emitting surface. Because the amount of roughened area can be precisely controlled, the light extraction efficiency can be precisely controlled, substantially independent of the particular process used to roughen the surface. Additionally, the selective roughening of the surface may be used to achieve a desired light emission output pattern.
    Type: Application
    Filed: January 3, 2013
    Publication date: November 6, 2014
    Inventors: Maciej Benedict, Paul S. Martin, Boris Kharas
  • Patent number: 8771577
    Abstract: A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: July 8, 2014
    Assignees: Koninklijke Philips N.V., Philips Lumileds Lighting Company, LLC
    Inventors: Grigoriy Basin, Paul S. Martin
  • Patent number: 8748921
    Abstract: A semiconductor light emitting device is provided with a separately fabricated wavelength converting element. The wavelength converting element, of e.g., phosphor and glass, is produced in a sheet that is separated into individual wavelength converting elements, which are bonded to light emitting devices. The wavelength converting elements may be grouped and stored according to their wavelength converting properties. The wavelength converting elements may be selectively matched with a semiconductor light emitting device, to produce a desired mixture of primary and secondary light.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: June 10, 2014
    Assignee: Philips Lumileds Lighting Company LLC
    Inventors: Paul S. Martin, Gerd O. Mueller, Regina B. Mueller-Mach, Helena Ticha, Ladislav Tichy
  • Publication number: 20130313562
    Abstract: LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features.
    Type: Application
    Filed: June 3, 2013
    Publication date: November 28, 2013
    Inventors: John Edward Epler, PAUL S. MARTIN, MICHAEL R. KRAMES
  • Patent number: 8471280
    Abstract: In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: June 25, 2013
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Rafael I. Aldaz, Grigoriy Basin, Paul S. Martin, Michael Krames
  • Patent number: 8455913
    Abstract: LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: June 4, 2013
    Assignee: Phiips Lumileds Lighting Company LLC
    Inventors: John Epler, Paul S. Martin, Michael R. Krames
  • Patent number: 8431423
    Abstract: An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: April 30, 2013
    Assignees: Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, LLC
    Inventors: Grigoriy Basin, Paul S. Martin
  • Patent number: 8273587
    Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: September 25, 2012
    Assignee: Lumileds Lighting Company LLC
    Inventors: Grigoriy Basin, Frederic Diana, Paul S. Martin, Dima Simonian
  • Patent number: 8232117
    Abstract: An LED wafer with a growth substrate is attached to a carrier substrate by, for example, a heat-releasable adhesive so that the LED layers are sandwiched between the two substrates. The growth substrate is then removed, such as by laser lift-off. The exposed surface of the LED layers is then etched to improve light extraction. A preformed phosphor sheet, matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet, LED layers, and, optionally, the carrier substrate are then diced to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: July 31, 2012
    Assignees: Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, LLC
    Inventors: Grigoriy Basin, Paul S. Martin
  • Publication number: 20110266569
    Abstract: An LED wafer with a growth substrate is attached to a carrier substrate by, for example, a heat-releasable adhesive so that the LED layers are sandwiched between the two substrates. The growth substrate is then removed, such as by laser lift-off. The exposed surface of the LED layers is then etched to improve light extraction. A preformed phosphor sheet, matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet, LED layers, and, optionally, the carrier substrate are then diced to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 3, 2011
    Applicants: PHILIPS LUMILEDS LIGHTING COMPANY, LLC, KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Grigoriy Basin, Paul S. Martin
  • Publication number: 20110223696
    Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.
    Type: Application
    Filed: May 25, 2011
    Publication date: September 15, 2011
    Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLC
    Inventors: Grigoriy Basin, Frederic Diana, Paul S. Martin, Dima Simonian
  • Publication number: 20110198780
    Abstract: A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.
    Type: Application
    Filed: February 16, 2010
    Publication date: August 18, 2011
    Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLC
    Inventors: Grigoriy BASIN, Paul S. MARTIN
  • Publication number: 20110108865
    Abstract: In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.
    Type: Application
    Filed: November 6, 2009
    Publication date: May 12, 2011
    Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLC
    Inventors: Rafael I. ALDAZ, Grigoriy BASIN, Paul S. MARTIN, Michael KRAMES
  • Publication number: 20110084301
    Abstract: LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features.
    Type: Application
    Filed: December 16, 2010
    Publication date: April 14, 2011
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: John Epler, Paul S. Martin, Michael R. Krames
  • Publication number: 20110057205
    Abstract: Overmolded lenses and certain fabrication techniques are described for LED structures. In one embodiment, thin YAG phosphor plates are formed and affixed over blue LEDs mounted on a submount wafer. A clear lens is then molded over each LED structure during a single molding process. The LEDs are then separated from the wafer. The molded lens may include red phosphor to generate a warmer white light. In another embodiment, the phosphor plates are first temporarily mounted on a backplate, and a lens containing a red phosphor is molded over the phosphor plates. The plates with overmolded lenses are removed from the backplate and affixed to the top of an energizing LED. A clear lens is then molded over each LED structure. The shape of the molded phosphor-loaded lenses may be designed to improve the color vs. angle uniformity. Multiple dies may be encapsulated by a single lens. In another embodiment, a prefabricated collimating lens is glued to the flat top of an overmolded lens.
    Type: Application
    Filed: November 15, 2010
    Publication date: March 10, 2011
    Inventors: Gerd Mueller, Regina Mueller-Mach, Grigoriy Basin, Robert Scott West, Paul S. Martin, Tze-Sen Lim, Stefan Eberle