Abstract: A configurable, connectorized system for providing supervisory and distributed control dramatically reduces the number of wire connections that must be made to connect sensors and actuators to a control system, reducing the number of different control hardware components required to connect one or more sensors and actuators through use of a configurable I/O module.

Abstract: A configurable, connectorized method and apparatus for driving a solenoid coil reduces energy consumption and heating of the solenoid coil, allows detection of the solenoid state, and simplifies connections to the solenoid.

Abstract: A computer-based simulator, separate from a computer process control system, that simplifies the electrical interconnection of the computer-based simulator to the computer control system and reduces the number of hardware components required to effect a computer-based simulator. The invention also facilitates remote configuration and operation of the control and simulator systems.

Abstract: A configurable, connectorized method and apparatus for driving a solenoid coil reduces energy consumption and heating of the solenoid coil, allows detection of the solenoid state, and simplifies connections to the solenoid.

Abstract: A computer-based simulator, separate from a computer process control system, that simplifies the electrical interconnection of the computer-based simulator to the computer control system and reduces the number of hardware components required to effect a computer-based simulator. The invention also facilitates remote configuration and operation of the control and simulator systems.

Abstract: A configurable, connectorized system for providing supervisory and distributed control dramatically reduces the number of wire connections that must be made to connect sensors and actuators to a control system, reducing the number of different control hardware components required to connect one or more sensors and actuators through use of a configurable I/O module.

Abstract: A configurable, connectorized method and apparatus for driving a solenoid coil reduces energy consumption and heating of the solenoid coil, allows detection of the solenoid state, and simplifies connections to the solenoid.

Abstract: A computer-based simulator, separate from a computer process control system, that simplifies the electrical interconnection of the computer-based simulator to the computer control system and reduces the number of hardware components required to effect a computer-based simulator. The invention also facilitates remote configuration and operation of the control and simulator systems.

Abstract: An input/output module includes a device communication connector apparatus for connecting at least one conductor between the module and at least one device and interface apparatus for causing the module to place any of a plurality of signals on any of a plurality of contacts of the device communication connector apparatus. The interface apparatus includes at least one electronic integrated circuit providing a selectable interconnection apparatus to a particular one of the contacts. The interface apparatus is configurable by a user of the module. A method of configuring the module includes providing inputs on a personal computer, communicating with a web server embedded in the module, to determine a specific interconnection apparatus for each of the contacts.

Abstract: An input/output module for implementing directions from a controller for sending and receiving signals to and from devices. The input/output module includes a microprocessor for communication with, and receiving programming from the controller. The input/output module further includes device communication connectors, each having number of pins, each pin for interconnection with a cable conductor to a device. The input/output module has an ASIC for each of the pins, providing a controlled interface with the corresponding pin. Each ASIC has interconnection apparatus, selectable by the microprocessor for providing a particular interface with the pin served by the ASIC.

Abstract: An input/output module for implementing directions from a controller for sending and receiving signals to and from devices. The input/output module includes a microprocessor for communication with, and receiving programming from the controller. The input/output module further includes device communication connectors, each having number of pins, each pin for interconnection with a cable conductor to a device. The input/output module has an ASIC for each of the pins, providing a controlled interface with the corresponding pin. Each ASIC has interconnection apparatus, selectable by the microprocessor for providing a particular interface with the pin served by the ASIC.

Abstract: A system for wafer handling employing a complex numerical method for calculating a path of wafer travel that controls wafer acceleration and jerk, and results in maximum safe speed of wafer movement from a first point to a second point. Motion is begun along a straight line segment while accelerating to a first path velocity. During this acceleration, the system computer calculates a series of straight line segments and interconnecting sinusiodally shaped paths over which the wafer is to be guided to the second point. The straight line segments and sinusiodally shaped paths are calculated so as to minimize total path length and the time required to move the wafer from the first point to the second point. The system computes the point of entrance and exit to and from each straight and sinusoidal path.

Abstract: An input/output module for implementing directions from a controller for sending and receiving signals to and from devices. The input/output module includes a microprocessor for communication with, and receiving programming from the controller. The input/output module further includes device communication connectors, each having number of pins, each pin for interconnection with a cable conductor to a device. The input/output module has an ASIC for each of the pins, providing a controlled interface with the corresponding pin. Each ASIC has interconnection apparatus, selectable by the microprocessor for providing a particular interface with the pin served by the ASIC.

Abstract: A system for making interconnections between an input/output module and a first device and a second device wherein the system uses standard cables and connectors. The input/output module includes a standard first connector for making connection with a standard first transmission line cable for conveying signals between the module and the first device, and at least one second connector, with such second connector connecting to a first end of a second standard cable. A second end of the second standard cable includes a standard cable connector for making connection to a corresponding connector of the second device. The input/output module is configured to contain programmable logic for making the required connections between the module and the first and second devices.

Abstract: A system for making interconnections between an input/output module and a first device and a second device wherein the system uses standard cables and connectors. The input/output module includes a standard first connector for making connection with a standard first transmission line cable for conveying signals between the module and the first device, and at least one second connector, with such second connector connecting to a first end of a second standard cable. A second end of the second standard cable includes a standard cable connector for making connection to a corresponding connector of the second device. The input/output module is configured to contain programmable logic for making the required connections between the module and the first and second devices.

Abstract: A system for wafer handling employing a complex numerical method for calculating a path of wafer travel that controls wafer acceleration and jerk, and results in maximum safe speed of wafer movement from a first point to a second point. Motion is begun along a straight line segment while accelerating to a first path velocity. During this acceleration, the system computer calculates a series of straight line segments and interconnecting sinusiodally shaped paths over which the wafer is to be guided to the second point. The straight line segments and sinusiodally shaped paths are calculated so as to minimize total path length and the time required to move the wafer from the first point to the second point. The system computes the point of entrance and exit to and from each straight and sinusoidal path.

Abstract: A system for making interconnections between an input/output module and a first device and a second device wherein the system uses standard cables and connectors. The input/output module includes a standard first connector for making connection with a standard first transmission line cable for conveying signals between the module and the first device, and at least one second connector, with such second connector connecting to a first end of a second standard cable. A second end of the second standard cable includes a standard cable connector for making connection to a corresponding connector of the second device. The input/output module is configured to contain programmable logic for making the required connections between the module and the first and second devices.

Abstract: A wafer handling apparatus having input and output robotic systems directed by a programmed controller. Each system has components including a robot, a twist and rotate, and a carrier and automated carrier rail. The input system is for removing wafers from their wafer pod, placing them in the carrier and transporting them via the rail to a wafer processing area. The output system performs the reverse operation, taking wafers from a carrier following processing and placing them in a pod. Each robot includes a plurality of interconnected, articulated cantilevered arms. The last one of the arms has a wand on one end and a laser emitter detector on the other end, and operates in cooperation with the controller to provide location detection of system components. The controller also includes circuitry for sensing contact of the wand with an object by measuring the increased robot motor torque occurring upon contact.

Abstract: Briefly, a preferred embodiment of the present invention includes a wafer carrier buffer for storage of a plurality of carriers containing wafers either waiting to be taken for processing in an adjacent wafer processing system, or waiting to be taken from the buffer following the processing. The buffer has a sliding carrier first input apparatus for taking a carrier from outside the buffer through a buffer input door and into the buffer interior. A buffer controller is included for directing robotic apparatus to take the carrier from the input apparatus and place it on a selected one of a plurality of carrier storage locations, and from a carrier storage location to a first output for delivery of wafers to processing. The robotic apparatus also delivers an empty carrier to a second input apparatus for receiving wafers from the processing area, and for delivery of a carrier with processed wafers to a second sliding output apparatus for removal from the buffer through a buffer output door.

Abstract: An alignment device for use with a robot for manipulating and aligning a series of semiconductor wafers with respect to an edge fiducial and the center of each wafer is disclosed. The device includes a rotary vacuum chuck for holding a wafer, and an edge detector comprising a light source that extends across the wafer edge as it moves and creates a shadow that falls on a charge coupled device (CCD) below. Output data from the CCD relative to the wafer edge position is processed by a programmable logic circuit and converted to quadrature data which is fed to the logic section of a controller. The controller is programmed to calculate the location of the wafer fiducial relative to the chuck axis and further to calculate the angular and distance offset of the wafer center from the longitudinal axis of the robot arm so that the robot arm can be moved to center the wafer with its fiducial at a preselected location before the wafer is removed from the rotary chuck.