Abstract: An adhesive material providing permeation-resistant characteristics, wherein the material comprises a surface having a plurality of microstructures interspersed with at least one ridge. The ridge is adapted to make continuous contact with a mating surface. In one embodiment, the ridge is linear. In an alternative embodiment, the ridge has a square pattern forming a mesh on the surface.

Abstract: A microfiber array comprising a plurality of fibers with roughened tips, where the microfiber array is adapted to provide enhanced grip to the surface of a semiconductor device and other smooth, flat objects. The microfiber array provides friction against movement in the horizontal direction, while providing controllable adhesion to allow for easy separation in the vertical direction.

Abstract: A dry adhesive microfiber array comprising a plurality of fibers with enlarged tips, where the dry adhesive is capable of adhering to a surface of a silicon wafer and/or carrier. The dry adhesive can be debonded without the use of chemicals or heat and does not leave a residue on the surface of the wafer. In addition, a liquid can be introduced to the interface between the dry adhesive and semiconductor device to adjust the force of adhesion.

Abstract: The present invention is a method that (i) allows for creating micro and/or nanostructures on either planar or non-planar three-dimensional surfaces in a single molding step, and (ii) allows for the molded production of complex high-aspect ratio micro and/or nanostructures including but not limited to cylinders, conical structures, low aspect-ratio channels, bumps, or posts. An example of such a complex structure are high aspect ratio pillars with enlarged “mushroom-shaped” or undercut tips which demonstrate enhanced, repeatable adhesion and shear strength on a variety of substrates when compared with other micro and/or nanostructures and unstructured materials. The mold of such a material requires an “undercut” feature that cannot be produced using typical micro/nano-molding processing techniques.

Abstract: Present invention describes a patterned and coated micro- and nano-scale fibers elastomeric material for enhanced adhesion in wet or dry environments. A multi-step fabrication process including optical lithography, micromolding, polymer synthesis, dipping, stamping, and photopolymerization is described to produce uniform arrays of micron-scale fibers with mushroom-shaped tips coated with a thin layer of an intrinsically adhesive synthetic polymer, such as lightly crosslinked p(DMA-co-MEA).

Abstract: The present invention is a method that (i) allows for creating micro and/or nanostructures on either planar or non-planar three-dimensional surfaces in a single molding step, and (ii) allows for the molded production of complex high-aspect ratio micro and/or nanostructures including but not limited to cylinders, conical structures, low aspect-ratio channels, bumps, or posts. An example of such a complex structure are high aspect ratio pillars with enlarged “mushroom-shaped” or undercut tips which demonstrate enhanced, repeatable adhesion and shear strength on a variety of substrates when compared with other micro and/or nanostructures and unstructured materials. The mold of such a material requires an “undercut” feature that cannot be produced using typical micro/nano-molding processing techniques.