Abstract: A system for automatic micro and macro inspection of patterned wafers, including a X-Y stage for supporting and positioning a wafer at a macro inspection station and a micro inspection station, a plurality of cassettes for storing a plurality of patterned wafers before and after inspection, a transfer arm and apparatus for transferring a wafer from the cassettes to a predetermined location on the X-Y stage, apparatus for centering the wafer on the macro inspection station, apparatus for aligning the wafer to obtain a preselected orientation for macro inspection, an optical system for effecting macro inspection of the wafer and storing a unique image thereof, apparatus for moving the wafer from the macro inspection station to the micro inspection station so that the area of the wafer corresponding to the stored unique image is in a micro optical path, autofocus apparatus for automatically focusing the lowest magnification objective lens on the area of the wafer to derive a real time image, a comparitor for com

Abstract: An automatic semiconductor wafer inspection system including a wafer inspector, a system computer that performs movement and function control and data storage functions and a high speed image computer. Patterned wafers selected for inspection are automatically transported from cassette storage to a vacuum chuck located on the X-Y stage and positioned in a macro inspection station. The wafer is aligned and the surface illumination is changed to test for macro defects under different lighting conditions and levels of magnification. The reflected light is applied to a camera where the optical image is converted to an electrical representation thereof, stored, and then processed by the high speed image computer. After a wafer has been positioned and inspected in the macro inspection station at low magnification, it is moved by a macro-micro transport arm to the micro inspection station and a unique image previously found in the low power image is found again and used for initial alignment.

Abstract: An automatic patterned wafer inspection system includes macro and micro inspection stations having optical axes that are 10 inches apart on an X-Y crossed roller stage which provides 7 inches of travel in each of two directions along two orthogonal axes. A macro-micro transport arm is pivotally interconnected with the stage and supports a turntable with a vacuum chuck centrally located thereon. The transport arm is positioned to move the wafer from a position 5 inches to the left of center of the stage (the macro axis) to a position 5 inches to the right of the center of the stage (the micro axis). Repeatability of positioning of the arms is obtained by using a spring-loaded link to drive the transport arm against a hard stop located at the left and right of the stage. The turntable is mounted so as to have an outside edge adjacent the distal end of the transport arm. A vacuum chuck for holding the wafer is attached to the turntable.

Abstract: Optical inspection apparatus for detecting differences between two dies in a photomask and including a carriage for supporting the objects to be inspected and for simultaneously moving such objects along an inspection path, an illuminator for illuminating corresponding portions of the objects as they are moved along the inspection path, electro-optical detectors for individually inspecting the illuminated portions and for developing first and second electrical signals respectively corresponding thereto, electronic memories for storing the first and second electrical signals, a computer for scanning the memories and for electronically aligning a readout of the first signal relative to a readout of the second signal, and a comparator for comparing the electronically aligned signals and for indicating any differences therebetween.

Abstract: Scanning apparatus is disclosed for use in computerized axial tomography systems. The apparatus includes an assembly rotatable about an axis extending along a central opening defined therein, and means for positioning the body portion to be examined within the central opening so that the axis of assembly rotation is perpendicular to a plane passing through the bodily structures to be examined. A source of penetrating radiation is mounted on the assembly toward one side thereof and provides radiation in the form of a fan beam. Detector means for the radiation are positioned on the assembly opposite the source, enabling detection of radiation which traverses laterally and is not absorbed in the thin body section in which the aforementioned plane resides. Means are provided for rotating the assembly so that the fan beam impinges upon said body portion at a plurality of incident directions.

Abstract: Optical inspection apparatus for detecting differences between two dies in a photomask and including a carriage for supporting the objects to be inspected and for simultaneously moving such objects along an inspection path, an illuminator for illuminating corresponding portions of the objects as they are moved along the inspection path, electro-optical detectors for individually inspecting the illuminated portions and for developing first and second electrical signals respectively corresponding thereto, electronic memories for storing the first and second electrical signals, a computer for scanning the memories and for electronically aligning a readout of the first signal relative to a readout of the second signal, and a comparator for comparing the electronically aligned signals and for indicating any differences therebetween.

Abstract: Scanning apparatus is disclosed for use in computerized axial tomography systems. The apparatus includes an assembly rotatable about an axis extending along a central opening defined therein, and means for positioning the body portion to be examined within the central opening so that the axis of assembly rotation is perpendicular to a plane passing through the bodily structures to be examined. A source of penetrating radiation is mounted on the assembly toward one side thereof and provides radiation in the form of a fan beam. Detector means for the radiation are positioned on the assembly opposite the source, enabling detection of radiation which traverses laterally and is not absorbed in the thin body section in which the aforementioned plane resides. Means are provided for rotating the assembly so that the fan beam impinges upon said body portion at a plurality of incident directions.