Abstract: An electronic package includes a first integrated circuit (IC) die arranged in a first orientation, a second IC die arranged in a second orientation inverted relative to the first orientation, at least one upper conductive routing layer extending over the first IC die and second IC die, at least one lower conductive routing layer extending under the first IC die and second IC die, and a mold compound at least partially encapsulating the first IC die and the second IC die.

Abstract: An apparatus includes an apparatus input to receive a voltage input, an apparatus output to drive an output metal oxide semiconductor field effect transistor (MOSFET) at least partially based upon the voltage input, a current source circuit to provide a current source to the apparatus output when the voltage input rises above a first threshold and before the voltage input rises above a second threshold, a voltage clamp circuit to provide a clamped output voltage to the apparatus output when the voltage input rises above the second threshold, and a current sink circuit to provide a current sink to the apparatus output when the voltage input falls below the second threshold and before the voltage input reaches the first threshold.