Abstract: A radio frequency (RF) circulator includes a low temperature co-fired ceramic (LTCC) substrate and a ferrite structure disposed in the LTCC substrate. The circulator also includes first, second and third transmission lines disposed in the LTCC substrate and coupled between the ferrite disk and first, second and third ports of the circulator. The ferrite structure embedded in the LTCC substrate is exposed to an appropriate direct current (DC) magnetic field, to provide the circulator as an integrated LTCC substrate circulator.

Abstract: A radio frequency (RF) circulator includes a low temperature co-fired ceramic (LTCC) substrate and a ferrite structure disposed in the LTCC substrate. The circulator also includes first, second and third transmission lines disposed in the LTCC substrate and coupled between the ferrite disk and first, second and third ports of the circulator. The ferrite structure embedded in the LTCC substrate is exposed to an appropriate direct current (DC) magnetic field, to provide the circulator as an integrated LTCC substrate circulator.

Abstract: A radio frequency (RF) circulator includes a low temperature co-fired ceramic (LTCC) substrate and a ferrite structure disposed in the LTCC substrate. The circulator also includes first, second and third transmission lines disposed in the LTCC substrate and coupled between the ferrite disk and first, second and third ports of the circulator. The ferrite structure embedded in the LTCC substrate is exposed to an appropriate direct current (DC) magnetic field, to provide the circulator as an integrated LTCC substrate circulator.

Abstract: A radio frequency (RF) circulator includes a low temperature co-fired ceramic (LTCC) substrate and a ferrite structure disposed in the LTCC substrate. The circulator also includes first, second and third transmission lines disposed in the LTCC substrate and coupled between the ferrite disk and first, second and third ports of the circulator. The ferrite structure embedded in the LTCC substrate is exposed to an appropriate direct current (DC) magnetic field, to provide the circulator as an integrated LTCC substrate circulator.

Abstract: A plurality of integrated circuits, such as microwave monolithic integrated circuits (MMICs), is supported upon a common carrier substrate having transmission lines for interconnection of signals between terminals of any one of the MMICs and among terminals of the plurality of MMICs. Circuit terminals at the front sides of the respective MMICs are connected electrically by vias to the back sides of the respective MMICs to be adjacent conductive components of the transmission lines. Electrically conductive bumps of metal or epoxy serve to connect the vias to the conductive components of the transmission lines, and to connect also metallized regions of the MMICs to metallized regions of the substrate.

Abstract: An RF connector includes an electrical insulator having an aperture and a conductive contact disposed within the aperture and having at least one compliant, compressible end. The insulator is disposed in an aperture of a conductive support plate. When an RF element is secured to the support plate in use, the compliant end of the conductive contact is compressed against a conductive pad of the RF element. In one embodiment, the RF connector includes a compressible, conductive annular ring disposed concentrically around the compliant end of the conductive contact and adapted for being compressed against a ground pad of the RF element in use in order to effect a coaxial RF interconnection. The conductive contact may take various forms, such as a watch band pin, a Fuzz Button.RTM. or a bellows arrangement. The RF connector may include RF circuitry for interconnection to the RF element and/or may interconnect the RF element to a second RF element.