Abstract: A wireless data communication card configured in accordance with an example embodiment of the invention includes a low profile antenna arrangement that does not protrude from the housing of the computing device when the wireless data communication card is inserted into the housing. The low profile design is achieved without compromising the radio frequency (“RF”) characteristics and performance of the wireless data communication card by tuning the antenna arrangement to account for conductive ground structure located within the housing of the computing device. In accordance with one practical embodiment of the invention, the wireless data communication card is compliant with IEEE Standard 802.11(b) and compliant with PCMCIA specifications.

Abstract: A telemetry component according to an embodiment of the invention, such as a programmer or a monitor for an implantable medical device (“IMD”), includes at least one radio frequency (“RF”) antenna that is configured to accommodate far-field telemetry between the telemetry component and the IMD. The RF antenna is shaped, sized, positioned, and otherwise configured to account for surface current cancellation caused by induced surface current on an electrically conductive surface of the telemetry component.

Abstract: A telemetry component according to an embodiment of the invention, such as a programmer or a monitor for an implantable medical device (“IMD”), includes at least one radio frequency (“RF”) antenna that is configured to accommodate far-field telemetry between the telemetry component and the IMD. The RF antenna is shaped, sized, positioned, and otherwise configured to account for surface current cancellation caused by induced surface current on an electrically conductive surface of the telemetry component.

Abstract: A medical device is configured to attenuate emission of electromagnetic radiation and comprises a housing, a circuit assembly mounted in the housing, and a panel coupled to the housing and to the circuit assembly. The panel comprises a first conductive region on an interior surface of the panel that is configured to be capacitively coupled to the ground, an opening substantially adjacent to the first conduction region, a second conductive region on the interior surface that is configured to be coupled to ground, and a non-conductive region on the interior surface between the first conductive region and the second conductive region.