Abstract: Disclosed herein is a power semiconductor device including a semiconductor body, a first load terminal, a second load terminal, an active region, an edge termination region, and a thin film layer that includes a bulk material and a laminar filler compound. Furthermore, a method of producing such a power semiconductor device is described herein, the method including: providing a thin film including a mixture of a bulk material component and a laminar filler compound onto a surface of at least parts of the edge termination region and/or over at least parts of the first load terminal; and curing the obtained mixture of the bulk material and laminar filler compound to generate a thin-film layer that includes a bulk material and a laminar filler compound.

Abstract: A polyamide molding composition filled with fine particulate metals for injection molding into practice hand grenades and shells which disintegrate into small pieces.

Abstract: An ejection device in the form of a chaff cartridge for dipoles for aircraft defense, through disorientation of the hostile aircraft cannon radar. The ejection device allows for the dipoles to be completely ejected and wherein, after the ejection, the individual dipoles are uniformly dispersed to provide for the formation of a homogeneous cloud. In order to obtain the foregoing pistons of the device are provided with sealing rings, and include guide surfaces which extend in the axial direction of the shell and which conform to the shell. Advantageous hereby is the uncomplicated and inexpensive construction of the pistons from sprayed plastic material parts, and wherein the sealing rings additionally serve as tolerance compensators between the otherwise expanding shell with regard to the pistons.