Abstract: In one embodiment, a wireless access point is disclosed comprising a housing that defines a compartment and a plurality of apertures configured to receive a plurality of fasteners; a gasket located along a perimeter of the compartment; an access cover for the compartment that defines a plurality of corresponding apertures (that align substantially with the plurality of apertures of the housing); and a hinge coupled to the housing and to the access cover. The hinge includes a first arm affixed to an interior portion of the compartment and extended substantially along a first axis; a second arm connected to the first arm at a first pivot point; a third arm connected to the second arm at a second pivot point; and a fourth arm affixed to an interior portion of the access cover and connected to the third arm at a third pivot point.

Abstract: In one embodiment, a wireless access point comprises a housing that defines a plurality of externally-facing apertures. The access point also comprises a radio module that is removably coupled to one of the externally-facing apertures of the housing and includes one or more antennas. The access point further comprises a motherboard module that is removably coupled to one of the externally-facing apertures of the housing and includes a motherboard that controls the one or more antennas of the radio module. The access point yet further comprises a power supply module that is removably coupled to one of the externally-facing apertures of the housing and supplies power to the motherboard and radio modules.

Abstract: A method for forecasting performance for and characterizing the properties of a multilayer low permeability gas reservoir. The method includes a coupled well/reservoir predictive model that accounts for pressure drop between layers, allowing accurate, rigorous, and rapid forecasting of reservoir performance. The method provides estimates of individual layer properties such as in-situ permeability, skin factor, fracture half-length, fracture conductivity, drainage area, etc. by simultaneously history matching production data and production log data using the coupled well/reservoir predictive model.

Abstract: An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.

Abstract: A liquid is applied by a bounded-region applicator such as a needle applicator over nozzle holes and over at least a continuous region close to the nozzle holes. The liquid is then cured to a solid before significant flow of the liquid into the nozzle holes. The liquid is chosen to cure to a solid which is sufficiently compliant that it deforms and leaves the nozzle holes under moderate pressure from a human hand or finger without breaking. Depending upon the material in which the nozzles are formed and the size of the nozzle holes, the liquid may be uniquely designed to incorporate resilient moieties or segments to satisfy these factors.

Abstract: Sealing tapes, such as those utilizing an ultra-thin adhesive layer for attaching the sealing tape to the nozzle member of an ink jet printhead. One such ultra-thin adhesive has a thickness of 3 microns or less, and can be applied using pressure or both heat and pressure.

Abstract: A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm?1 on the micro-fluid ejection device structures or on the cartridge body.

Abstract: Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.

Abstract: A method, and an apparatus employing the method, of using a laser to secure a composite film to a substrate. The method includes the acts of positioning the composite film adjacent the substrate, and heating at least a portion of the composite film with the laser and thereby tack the composite film to the substrate.

Abstract: A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.

Abstract: A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.

Abstract: A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The ejection device includes an ejection head substrate having a fluid supply side and a device side and containing two or more fluid flow paths therein for supplying fluid from the fluid supply side to the device side thereof. A multi-channel manifold is attached to the fluid supply side of the ejection head substrate for providing fluid from two or more fluid reservoirs to the fluid flow paths in the ejection head substrate. The multi-channel manifold has fluid flow channels therein in fluid flow communications with the fluid flow paths in the ejection head substrate and the manifold consists essentially of a patterned photoresist material.

Abstract: A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm?1 on the micro-fluid ejection device structures or on the cartridge body.

Abstract: The invention provides a micro-fluid ejection head for a micro-fluid ejection device and a method for making a micro-fluid ejection head. The micro-fluid ejection head includes a semiconductor substrate containing fluid ejection devices electrically connected to contact pads on a surface thereof. A TAB circuit including lead beams is electrically connected to the contact pads on the semiconductor substrate surface. A nozzle plate structure is provided and installed relative to the TAB circuit so as to substantially cover the lead beams and contact pads in order to protect the lead beams and contact pads from exposure to fluid ejected by the micro-fluid ejection device. The micro-fluid ejection head is effective to reduce contact between electrical components and the fluid without the use of a separate encapsulant material.

Abstract: An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.

Abstract: Methods for disassembling at least two components of an inkjet printhead include applying heat, preferably in the form of laser energy, to one of the components and wholly or partially separating the components thereafter. The disassembly enables ease of refilling the inkjet printhead or replacing original parts. In one embodiment, the components comprise inkjet printhead lids and bodies originally laser welded to one another. In another aspect, methods of disassembly include laser unwelding inkjet printhead lids and bodies according to whether the inkjet printhead body embodies a mono or color ink body type through use of selective control of one or more laser light sources to illuminate the inkjet printhead lid in a specific pattern of light. Still other aspects include a disassembled inkjet printhead having components with laser welding residue thereon. The laser welding residue may have substantially matching edge lines between the two components.

Abstract: A printing cartridge including a body, the body having a base and a tower defining a passageway. The tower is made from a first polymer material, and has a proximal end and a distal end. The proximal end is attached to the base. The distal end includes a surface. A frame, made of a second polymer material different from the first polymer material, is attached to the surface of the tower. A filter is attached to the frame and positioned to extend over the passageway.

Abstract: A low-profile ink jet cartridge assembly for an ink jet printer. The low profile ink jet cartridge assembly includes a substantially rectangular ink jet cartridge body having a printhead side, opposing side surfaces attached to the printhead side and a length, a height, and a width, wherein the length is greater than the height and the width. A printhead containing a semiconductor substrate is attached to the printhead side of the ink cartridge. A flexible circuit having a width, a length, a first edge along the length thereof, a second edge along the length thereof, first printer contact pads along at least a portion of the length thereof adjacent the first edge, and second printer contact pads along at least a portion of the length thereof adjacent the second edge is attached to the ink cartridge on the opposing side surfaces of the cartridge body.

Abstract: A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includes providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto a portion of the ink jet print cartridge thereby forming a layer of encapsulant material to protect electrical components or other printhead components.

Abstract: An apparatus for a laser transmission welding process for attaching a synthetic filter material to a filter tower frame in an ink jet printer cartridge. The apparatus includes a laser beam source and a filter clamping fixture containing a base, slide rods attached on first ends thereof to the base, an optics support plate attached to second ends of the slide rods, a movable platform for holding an ink cartridge slidably disposed on the slide rods between the base and the optics support plate, a platform moving device for translating the platform to and from a laser welding position, a laser beam transparent plate suspended by support legs from the optics support plate to a position between the movable platform and the optics support plate. The apparatus greatly improves synthetic filter attachment to a filter tower frame in an ink cartridge.