Abstract: Systems and methods for cooling one or more electrical components of a current conversion device of a renewable energy power system (e.g. a wind turbine or a solar power system) are disclosed. In one embodiment, the system includes an immersion tank comprising a cooling medium, a heat exchanger, and a pumping device. One or more of the electrical components are at least partially submerged within the cooling medium, which has a predetermined dielectric constant. The heat exchanger is in fluid communication with the cooling medium of the immersion tank. Thus, the pumping device is configured to circulate the cooling medium between the immersion tank and the heat exchanger to remove heat from the one or more electrical components.

Abstract: Systems and methods for cooling one or more electrical components of a current conversion device of a renewable energy power system (e.g. a wind turbine or a solar power system) are disclosed. In one embodiment, the system includes an immersion tank comprising a cooling medium, a heat exchanger, and a pumping device. One or more of the electrical components are at least partially submerged within the cooling medium, which has a predetermined dielectric constant. The heat exchanger is in fluid communication with the cooling medium of the immersion tank. Thus, the pumping device is configured to circulate the cooling medium between the immersion tank and the heat exchanger to remove heat from the one or more electrical components.

Abstract: A power converter includes a plurality of semiconductor switching devices coupled in a parallel configuration and positioned proximate each other in an interlaced configuration with respect to a plurality of electrical phases. The interlaced configuration facilitates inducing an electric current flow through each semiconductor switching device of the plurality of semiconductor switching devices that cancels at least a portion of current imbalances between at least a portion of the plurality of semiconductor switching devices.

Abstract: An electric power converter for a renewable power source includes at least one alternating current (AC) conduit coupled to an external AC power device and at least one direct current (DC) conduit coupled to an external DC power device. The converter also includes at least one immersion structure defining at least one immersion cavity therein and a plurality of semiconductor devices. The semiconductor devices include a substrate positioned within the immersion cavity. The substrate defines a plurality of heat transfer surfaces thereon. The semiconductor devices also include at least one semiconductor die coupled to the substrate, the AC conduit, and the DC conduit. The converter further includes a liquid at least partially filling the immersion cavity such that the semiconductor die is fully immersed in and in direct contact with the liquid. Heat generated in the semiconductor device induces a phase change in the liquid.

Abstract: A power converter includes a plurality of semiconductor switching devices coupled in a parallel configuration and positioned proximate each other in an interlaced configuration with respect to a plurality of electrical phases. The interlaced configuration facilitates inducing an electric current flow through each semiconductor switching device of the plurality of semiconductor switching devices that cancels at least a portion of current imbalances between at least a portion of the plurality of semiconductor switching devices.

Abstract: An electric power converter for a renewable power source includes at least one alternating current (AC) conduit coupled to an external AC power device and at least one direct current (DC) conduit coupled to an external DC power device. The converter also includes at least one immersion structure defining at least one immersion cavity therein and a plurality of semiconductor devices. The semiconductor devices include a substrate positioned within the immersion cavity. The substrate defines a plurality of heat transfer surfaces thereon. The semiconductor devices also include at least one semiconductor die coupled to the substrate, the AC conduit, and the DC conduit. The converter further includes a liquid at least partially filling the immersion cavity such that the semiconductor die is fully immersed in and in direct contact with the liquid. Heat generated in the semiconductor device induces a phase change in the liquid.

Abstract: An apparatus for cooling electrical protective devices comprises an electrical protective device mounted to at least one electrical terminal, wherein the electrical terminals are cooled to indirectly cool the electrical protective devices. A pressurized coolant source passes a coolant fluid through coolant passages attached to the electrical terminals, thereby cooling the electrical terminals. The cooled electrical terminals maintain the temperature of the electrical protection device within an appropriate operating temperature range. This cooling method may be used to increase the fuse power rating of a fuse array while maintaining electrical coordination between the fuses in the fuse array and electrical devices protected by the fuse array.

Abstract: An apparatus for cooling electrical protective devices comprises an electrical protective device mounted to at least one electrical terminal, wherein the electrical terminals are cooled to indirectly cool the electrical protective devices. A pressurized coolant source passes a coolant fluid through coolant passages attached to the electrical terminals, thereby cooling the electrical terminals. The cooled electrical terminals maintain the temperature of the electrical protection device within an appropriate operating temperature range. This cooling method may be used to increase the fuse power rating of a fuse array while maintaining electrical coordination between the fuses in the fuse array and electrical devices protected by the fuse array.

Abstract: A system for temperature control of an electronic component includes a heat plate supporting the component; a heat plate temperature sensor; a fan capable of providing air for cooling the heat plate; and a fan control for using the heat plate temperature to control the operation of the fan to provide a substantially constant heat plate temperature. The system can further include a heat pipe assembly having fins and coupled to the heat plate with the fan capable of providing air to the fins. The heat pipe assembly can include at least two heat pipes each having first ends coupled to the heat plate and second ends situated in a condensation section where at least one of the heat pipes has a different working fluid than an other.