Abstract: A diode has a semiconductor body having a first and a second semiconductor body main side. The semiconductor body has a first semiconductor zone. The semiconductor body has a second semiconductor zone arranged on the first semiconductor zone in an inner region of the semiconductor body and not extending as far as the semiconductor body edge of the semiconductor body. The semiconductor body has a third semiconductor zone arranged on the second semiconductor zone and has a higher doping concentration than the second semiconductor zone. The semiconductor body has a fourth semiconductor zone arranged on the first semiconductor zone in a semiconductor body edge region and extending from the second semiconductor zone in the direction towards the semiconductor body edge as far as the semiconductor body edge.

Abstract: A diode has a semiconductor body having a first and a second semiconductor body main side, wherein the semiconductor body has a first semiconductor zone, wherein the semiconductor body has a second semiconductor zone arranged on the first semiconductor zone in an inner region of the semiconductor body and not extending as far as the semiconductor body edge of the semiconductor body, wherein the semiconductor body has a third semiconductor zone arranged on the second semiconductor zone and having a higher doping concentration than the second semiconductor zone, wherein the semiconductor body has a fourth semiconductor zone arranged on the first semiconductor zone in a semiconductor body edge region and extending from the second semiconductor zone in the direction towards the semiconductor body edge as far as the semiconductor body edge, wherein the semiconductor body has a cutout proceeding from a planar outer surface of the third semiconductor zone, which forms a surface region of the second semiconductor bod

Abstract: The printed circuit board is produced without soldering lands around the contacting, supporting or interconnecting holes of a simple faced, double-faced or multilayer circuit.The inner wall of the hole is covered with a copper layer which extends only until the free surfaces of the naked board, i.e. levels that surface, or does not fully extend until this level. The said layer is covered with a tin-lead metallization layer which services as a soldering link element. The solder mounts towards the wire or pin of the soldered component but does not touch nor spoil the free, insulating surface of the support.One necessary condition of the making process of the board is the precise, clean, proper and sharp drilling of the holes.

Abstract: The printed circuit board is produced without soldering lands around the contacting, supporting or interconnecting holes of a simple faced, double-faced or multilayer circuit.The inner wall of the hole is covered with a copper layer which extends only until the free surface of the naked board, i.e. levels that surface, or does not fully extend until this level. The said layer is covered with a tin-lead metallisation layer which serves as a soldering link element. The solder mounts towards the wire or pin of the soldered component but does not touch nor spoil the free, insulating surface of the support.One necessary condition of the making process of the board is the precise, clean, proper and sharp drilling of the holes.