Abstract: A single caterer or multiple caterers may provide individualized meals for a large number of customers at a number of different institutions. A server computer has individual accounts for each customer, caterer, institution accounts grouping the customers by the institution with which they are affiliated, and an administration account for management functions and kitchen related modules such as preparation sheets. Significantly, with the method of the invention that relationship need not include any food preparation, billing for food, or menu collation, creation or the like by the institution. The kitchen will prepare a monthly menu of options available to the customers, who use individual accounts to access the monthly menu of choices and select menu options for each day and pay the caterer using a payment module. The catering system of the invention then handles payments to the caterers.

Abstract: According to one embodiment of the present invention, a semiconductor device includes a first layer of dielectric material disposed upon an upper surface of a substrate of a semiconductor device and a first non-conductive layer of metal disposed upon an upper surface of the dielectric material. The first layer of dielectric material and the first non-conductive layer of metal act as an optical trap for electromagnetic radiation received by the first non-conductive layer of metal. In particular embodiments, the semiconductor device may further comprise a second layer of dielectric material disposed upon an upper surface of the first non-conductive layer of metal and a second non-conductive layer of metal disposed upon an upper surface of the second layer of dielectric material.