Abstract: A multilayer printed circuit board included a plurality of substrates bonded together in which the surface area of each substrate is divided into equal surface areas in which each area may contain the same number and lengths of lines of conductive elements, monitor holes, plated-through holes and circuit components. Connecting pads mounted within each substrate and intersected by a plated-through hole are positioned adjacent the conductive elements within the substrate and are connected to the elements by connecting segments. The circuit components mounted on a surface of the circuit board have their lead elements connected by bridge members to a monitor hole for testing purposes, said bridge member being severable to isolate the circuit components. A method for manufacturing such a multilayer printed circuit board is likewise disclosed.