Patents by Inventor Paul T. Tsutsumi

Paul T. Tsutsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronics cooling technique for spacecraft modules
    Patent number: 6005771
    Abstract: A spacecraft avionics module in which integrated circuit chip packages or chips are mounted in direct contact with the surface of a radiator panel, to enhance dissipation of heat from the integrated circuit and to allow electronics to be packed more densely while still dissipating sufficient heat to allow the electronics to operate at a desirable temperature. Conduction of heat from the electronics to the radiator panel is further enhanced by the use of a thermally conductive adhesive disposed between the integrated circuit chip packages or chips and the radiator panel, which may include heatpipes for more uniform heat distribution across the panel.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: December 21, 1999
    Assignee: TRW Inc.
    Inventors: William D. Bjorndahl, Paul T. Tsutsumi, Ramon Coronel, Janice W. Espinosa