Patents by Inventor Paul T. VU

Paul T. VU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240103068
    Abstract: An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: AEHR TEST SYSTEMS
    Inventors: Donald P. Richmond, II, Kenneth W. Deboe, Frank O. Uher, Jovan Jovanovic, Scott E. Lindsey, Thomas T. Maenner, Patrick M. Shepherd, Jeffrey L. Tyson, Mark C. Carbone, Paul W. Burke, Doan D. Cao, James F. Tomic, Long V. Vu
  • Patent number: 11128741
    Abstract: In one example in accordance with the present disclosure, a system for auto-negotiation over extended backplane includes an enclosure and a switch external to the enclosure. The enclosure has a NIC (network interface controller) for a server in the enclosure and a DEM (downlink extension module). The DEM has a single DEM PHY connected to the NIC via a backplane and also connected to the switch via an external connection. The DEM PHY facilitates auto-negotiation between the switch and the NIC.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: September 21, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Guodong Zhang, Paul T. Vu, Michael Lee Witkowski, Robert R. Teisberg, John V. Butler
  • Publication number: 20200084304
    Abstract: In one example in accordance with the present disclosure, a system for auto-negotiation over extended backplane includes an enclosure and a switch external to the enclosure. The enclosure has a NIC (network interface controller) for a server in the enclosure and a DEM (downlink extension module). The DEM has a single DEM PHY connected to the NIC via a backplane and also connected to the switch via an external connection. The DEM PHY facilitates auto-negotiation between the switch and the NIC.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 12, 2020
    Inventors: Guodong Zhang, Paul T. Vu, Michael Lee Witkowski, Robert R. Teisberg, John V. Butler
  • Patent number: 10484519
    Abstract: In one example in accordance with the present disclosure, a system for auto-negotiation over extended backplane includes an enclosure and a switch external to the enclosure. The enclosure has a NIC (network interface controller) for a server in the enclosure and a DEM (downlink extension module). The DEM has a single DEM PHY connected to the NIC via a backplane and also connected to the switch via an external connection. The DEM PHY facilitates auto-negotiation between the switch and the NIC.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: November 19, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Guodong Zhang, Paul T. Vu, Michael Lee Witkowski, Robert R. Teisberg, John V. Butler
  • Publication number: 20170244817
    Abstract: In one example in accordance with the present disclosure, a system for auto-negotiation over extended backplane includes an enclosure and a switch external to the enclosure. The enclosure has a NIC (network interface controller) for a server in the enclosure and a DEM (downlink extension module). The DEM has a single DEM PHY connected to the NIC via a backplane and also connected to the switch via an external connection. The DEM PHY facilitates auto-negotiation between the switch and the NIC.
    Type: Application
    Filed: December 1, 2014
    Publication date: August 24, 2017
    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Guodong ZHANG, Paul T. VU, Michael Lee WITKOWSKI, Robert R. TEISBERG, John V. BUTLER