Abstract: An ink coupling for connecting an inkjet printer and a replaceable cartridge configured to not drip ink upon detachment. The coupling has a cartridge valve on the cartridge side of the coupling and a printer conduit on the printer side of the coupling. The cartridge valve and the printer conduit having complementary formations configured to form a coupling seal when brought into engagement. The cartridge valve is biased closed and configured to open when brought into engagement with the printer conduit. Upon disengagement, the coupling seal breaks after the cartridge valve closes, and an ink meniscus forms and recedes from the complementary formations as they separate, the cartridge valve having external surfaces configured so that the meniscus travels across the external surfaces and only pins itself to the printer conduit surfaces.

Abstract: A printhead for an inkjet printer that has a printhead integrated circuit (IC) with an array of nozzles for ejecting ink, and a support structure for mounting the printhead IC within the printer. The support structure has ink conduits for supplying the array of nozzles with ink, the ink conduits have a meniscus anchor for pinning part of an advancing meniscus of ink to divert the advancing meniscus from a path it would otherwise take. If a printhead consistently fails to prime correctly because a meniscus pins at one or more points, then the advancing meniscus can be directed so that it does not contact these critical points. Deliberately incorporating a discontinuity into an ink conduit immediately upstream of the problem area can temporarily pin to the meniscus and skew it to one side of the conduit and away from the undesirable pinning point.

Abstract: A detachable fluid coupling for connecting an inkjet printhead with an ink supply, the detachable coupling having a fixed valve member defining a valve seat, a sealing collar (146) for sealing engagement with the valve seat (148), a resilient sleeve (126) having one annular end fixed relative to the fixed valve member (128), and the other annular end engaging the sealing collar to bias it into sealing engagement with the valve seat. The coupling also having a conduit opening (150) that is movable relative to the fixed valve member for engaging the sealing collar (146) to unseal it from the valve seat. Unsealing the sealing collar from the valve seat compresses the resilient sleeve (126) such that an intermediate section of the sleeve displaces outwardly relative to the annular ends. With a resilient sleeve that buckles or folds outwardly, the diameter of the coupling is smaller that the conventional couplings that use an annular resilient element that biases the valve shut remaining residual tension.

Abstract: The present invention relates to spatially arranging a plurality of particles in a device for the oral delivery of a pharmaceutical. In particular, the plurality of particles is utilized for the oral delivery of a pharmaceutical to a subject via the drinking device.

Abstract: The invention provides methods and compositions for the oral delivery of pharmaceutically active agents. In particular, the compositions generally comprise a plurality of pharmaceutically active agents embedded in a matrix that is substantially erodable when contacted with an aqueous medium. The compositions may also include an inner core comprising an inert material. The compositions may be introduced into the oral cavity of a subject by liquid beverage or food product comprising a composition of the invention.

Abstract: A printhead that has a printhead integrated circuit (IC) (68) which is elongate and has an array of nozzles for ejecting ink. The printhead also has a support structure 176 for supporting the printhead IC and having ink outlets 186 for supplying the array of nozzles with ink. The ink outlets are spaced along the printhead IC such that the ink outlet spacing (210, 212) decreases at the ends of the printhead IC. By increasing the number of ink outlets near the end regions, the ink supply is enhanced to compensate for the slower priming of the end nozzles. This, in turn, makes the whole nozzle array prime more consistently to avoid flooding and ink wastage from early priming nozzles (or alternatively, unprimed end nozzles).

Abstract: Methods and apparatuses for applying a protective material to an interconnect associated with a component. One such method involves placing a stencil in close proximity to an interconnect that extends over a cavity. An amount of protective material is placed on the stencil. A wiper is passed across the stencil. The wiper has an angle of attack of less than 50 degrees. At least a desired thickness of protective material is applied to the interconnect.

Abstract: A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.

Abstract: A printhead for an inkjet printer that has an elongate array of nozzles (68) for ejecting ink and ink conduits for supplying the array of nozzles with ink. The ink conduits extend adjacent the elongate array and have a plurality of pulse dampers individually in fluid communication with the ink conduits, each containing a volume of gas for compression by pressure pulses in the ink conduits, distributed along the length of the elongate array. A pressure pulse moving through an elongate printheads, such as a pagewidth printhead, can be damped at any point in the ink flow line. However, the pulse will cause nozzle flooding as it passes the nozzles in the printhead integrated circuit, regardless of whether it is subsequently dissipated at the damper. By incorporating a number of pulse dampers into the ink supply conduits immediately next to the nozzle array, any pressure spikes are damped at the site where they would otherwise cause detrimental flooding.

Abstract: A printhead for an inkjet printer that has a printhead integrated circuit (68) with nozzles for ejecting ink, and a support structure (64, 176, 108) for supporting the printhead IC. The support structure has ink conduits (182) for supplying the nozzles with ink and a fluidic damper 200 containing gas for compression by pressure pulses in the ink within the ink conduits to dissipate the pressure pulse. Damping pressure pulses using gas compression can be achieved with small volumes of gas. This preserves a compact design while avoiding any nozzle flooding from transient spikes in the ink pressure.

Abstract: A printhead for an inkjet printer that has a printhead integrated circuit (68) with nozzles for ejecting ink and a support structure (64, 174, 176) for supporting the printhead IC. The support structure having ink conduits (182) for supplying the array of nozzles. A plurality of cavities (200), each cavity having an opening that establishes fluid communication with the ink conduits, the openings being configured such that the cavities do not prime with ink when the ink conduits are primed from the ink supply. By leaving unprimed cavities throughout the support structure, any pressure pulses in the ink are damped by compression of the trapped gas pockets. Distributing the cavities rather than using one relatively large cavity, means that the pressure pulse is being damped along the length of the printhead IC, instead of allowing the pulse to travel the length of the ink conduit until it reaches the single damper and compresses the gas.

Abstract: The invention provides a micro-fluid ejection head for a micro-fluid ejection device and a method for making a micro-fluid ejection head. The micro-fluid ejection head includes a semiconductor substrate containing fluid ejection devices electrically connected to contact pads on a surface thereof. A TAB circuit including lead beams is electrically connected to the contact pads on the semiconductor substrate surface. A nozzle plate structure is provided and installed relative to the TAB circuit so as to substantially cover the lead beams and contact pads in order to protect the lead beams and contact pads from exposure to fluid ejected by the micro-fluid ejection device. The micro-fluid ejection head is effective to reduce contact between electrical components and the fluid without the use of a separate encapsulant material.

Abstract: A low-profile ink jet cartridge assembly for an ink jet printer. The low profile ink jet cartridge assembly includes a substantially rectangular ink jet cartridge body having a printhead side, opposing side surfaces attached to the printhead side and a length, a height, and a width, wherein the length is greater than the height and the width. A printhead containing a semiconductor substrate is attached to the printhead side of the ink cartridge. A flexible circuit having a width, a length, a first edge along the length thereof, a second edge along the length thereof, first printer contact pads along at least a portion of the length thereof adjacent the first edge, and second printer contact pads along at least a portion of the length thereof adjacent the second edge is attached to the ink cartridge on the opposing side surfaces of the cartridge body.

Abstract: The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

Abstract: An ink jet printhead assembly includes a heater chip having a backside with at least one cavity. A substrate is associated with the backside of the heater chip. Adhesive is at least partially disposed within the at least one cavity. The adhesive adheres the backside of the heater chip to the substrate.

Abstract: A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.

Abstract: A corrosion resistant tile and a protective tiling system comprising polyurea or polyvinyl chloride tiles having notched or grooved perimeter end surfaces, either z-shaped or curvilinear. Adjacent end surfaces of adjacent tiles form a reservoir for receiving joint or seam filler which acts to seal out contaminants from substrates on which the tiles are placed.

Abstract: A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.

Abstract: The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

Abstract: The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.