Patents by Inventor Paul Townsend III

Paul Townsend III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for making air gap containing semiconducting devices and resulting semiconducting device
    Publication number: 20050124172
    Abstract: A method of forming at least a partial air gap within a semiconducting device and the resulting devices, said method comprising the steps of: (a) depositing a sacrificial polymeric composition in one or more layers of the device during its formation; (b) coating the device with one or more layers of a relatively non-porous, organic, polymeric, insulating dielectric material (hardmask) having a density less than 2.2 g/cm3; and (c) decomposing the sacrificial polymeric composition such that the decomposition products permeate at least partially through the one or more hardmask layers, thereby forming at least a partial air gap within the device.
    Type: Application
    Filed: April 1, 2003
    Publication date: June 9, 2005
    Inventors: Paul Townsend III, Kenneth Foster